Input device

ABSTRACT

An input device is provided and including a substrate; a plurality of first metal or alloy electrodes provided along a first direction on a main surface of the substrate; a plurality of second metal or alloy electrodes provided along a second direction intersecting with the first direction on the same surface as the main surface; and a protective film covering the plurality of first metal or alloy electrodes and the plurality of second metal or alloy electrodes.

CROSS-REFERENCE TO RELATED APPLICATION

The present application is a continuation of U.S. patent applicationSer. No. 16/020,331, filed on Jun. 27, 2018, which application is acontinuation of U.S. patent application Ser. No. 15/187,065, filed onJun. 20, 2016, and issued as U.S. Pat. No. 10,031,630 on Jul. 24, 2018,which application claims priority from Japanese Patent Application No.2015-145778 filed on Jul. 23, 2015, the content of which is herebyincorporated by reference into this application.

BACKGROUND

The invention relates to a display, an input device, and a method ofmanufacturing the display.

Recently, there is a technique in which an input device called a touchpanel or a touch sensor is mounted to a display plane side of a display,and an input position is detected and output when an input tool such asa finger or a touch pen is in contact with the touch panel to perform aninput operation. In addition, an electrostatic capacitance system is oneof detection systems to detect a contact position at which the finger orthe like is in contact with the touch panel. In a touch panel using theelectrostatic capacitance system, a pair of electrodes oppositelyarranged with a dielectric layer interposed therebetween, that is, aplurality of capacitive elements formed of a drive electrode and adetection electrode are provided inside a plane of the touch panel.Further, the input position is detected using a fact that electrostaticcapacitance of the capacitive element changes when the input tool suchas the finger and the touch pen is in contact with the capacitiveelement to perform the input operation.

There is a touch panel in which a plurality of drive electrodes and aplurality of detection electrodes are formed on the same plane in orderto reduce a thickness, for example, of the display provided with such atouch panel. Each of the plurality of drive electrodes includes aplurality of first electrode portions, which are arranged with aninterval in a first direction, and each of the plurality of detectionelectrodes includes a plurality of second electrode portions which arearranged with an interval in a second direction.

For example, Japanese Patent Application Laid-Open Publication No.2013-218647 (Patent Document 1) describes a technique regarding aconductor pattern structure of an electrostatic capacitive touch panelwhich is provided with first-axis conductor assemblies having aplurality of first-axis conductive cells arranged on a surface of arigid substrate, and second-axis conductor assemblies having a pluralityof second-axis conductive cells arranged on the surface of the rigidsubstrate.

For example, Japanese Patent Application Laid-Open Publication No.2013-206198 (Patent Document 2) describes a technique regarding a touchsensor in which a first electrode pattern has a plurality of firstisland-shaped electrode portions formed with an interval in a firstdirection on a substrate, and a second electrode pattern has a pluralityof second island-shaped electrode portions formed with an interval in asecond direction on the substrate.

For example, Japanese Patent Application Laid-Open Publication No.2014-85771 (Patent Document 3) describes a technique regarding anelectrostatic capacitive touch panel sensor substrate in which firstelectrodes and second electrodes are arranged in a lattice shape on atransparent substrate, the first electrodes are coupled via a firstconnection portion to form a first electrode column, and the secondelectrodes are coupled via a second connection portion to form a secondelectrode column.

SUMMARY

It is difficult to easily reduce each resistance of the drive electrodeand the detection electrode in a case where each of the plurality offirst electrode portions included in the drive electrode and each of theplurality of second electrode portions included in the detectionelectrode are composed of a transparent conductive film made of, forexample, indium tin oxide (ITO) or the like. Thus, it is difficult toeasily improve detection speed or detection sensitivity in touchdetection. Alternatively, when a width dimension of the drive electrodeor the detection electrode is widened in order to reduce each resistanceof the drive electrode and the detection electrode, positional accuracyof the touch detection is likely to decrease.

The invention has been made in order to solve the above-describedproblems of the related art, and an object thereof is to provide adisplay capable of easily reducing each resistance of a drive electrodeand a detection electrode, in the display which is provided with aninput device having the drive electrode and the detection electrodeformed on the same plane.

Of the inventions disclosed in this application, the summaries of therepresentatives will be explained as below.

A display as one aspect of the present invention includes: a firstsubstrate having a first main surface; a second substrate having asecond main surface and a third main surface on an opposite side of thesecond main surface; a plurality of pixels which are provided on thefirst main surface of the first substrate; and

a plurality of first electrodes and a plurality of second electrodeswhich are provided on the third main surface of the second substrate.The first main surface of the first substrate is opposite to the secondmain surface of the second substrate. Each of the plurality of firstelectrodes is provided along a first direction and is arranged with aninterval in a second direction intersecting with the first direction ina planar view. Each of the plurality of second electrodes is providedalong the second direction and is arranged with an interval in the firstdirection in a planar view. Each of the plurality of first electrodesincludes: a plurality of first electrode portions which are arrangedwith an interval in the first direction in a planar view; and aplurality of first connection portions each of which electricallyconnects the two first electrode portions adjacent to each other in thefirst direction. Each of the plurality of second electrodes includes: aplurality of second electrode portions which are arranged with aninterval in the second direction in a planar view; and a plurality ofsecond connection portions each of which electrically connects the twosecond electrode portions adjacent to each other in the seconddirection. Any one of the plurality of first connection portionsoverlaps with any one of the plurality of second connection portions ina planar view. Each of the plurality of first electrode portionscontains metal or alloy, and has a mesh shape, and each of the pluralityof second electrode portions contains metal or alloy, and has a meshshape.

An input device as one aspect of the present invention includes: a firstsubstrate having a first main surface; and a plurality of firstelectrodes and a plurality of second electrodes which are provided onthe first main surface of the first substrate. Each of the plurality offirst electrodes is provided along a first direction and is arrangedwith an interval in a second direction intersecting with the firstdirection in a planar view. Each of the plurality of second electrodesis provided along the second direction and is arranged with an intervalin the first direction in a planar view. Each of the plurality of firstelectrodes includes: a plurality of first electrode portions which arearranged with an interval in the first direction in a planar view; and aplurality of first connection portions each of which electricallyconnects the two first electrode portions adjacent to each other in thefirst direction. Each of the plurality of second electrodes includes: aplurality of second electrode portions which are arranged with aninterval in the second direction in a planar view; and a plurality ofsecond connection portions each of which electrically connects the twosecond electrode portions adjacent to each other in the seconddirection. Any one of the plurality of first connection portionsoverlaps with any one of the plurality of second connection portions ina planar view. Each of the plurality of first electrode portionscontains metal or alloy, and has a mesh shape, and each of the pluralityof second electrode portions contains metal or alloy, and has a meshshape.

A method of manufacturing a display as one aspect of the presentinvention includes the steps of: (a) preparing a first substrate havinga first main surface; and (b) preparing a second substrate having asecond main surface and a third main surface on an opposite side of thesecond main surface. Further, the method of manufacturing the displayincludes the steps of: (c) providing a plurality of pixels on the firstmain surface of the first substrate; (d) providing a plurality of firstelectrodes and a plurality of second electrodes on the third mainsurface of the second substrate; and (e) oppositely arranging the firstsubstrate and the second substrate such that the first main surface ofthe first substrate is opposite to the second main surface of the secondsubstrate. Each of the plurality of first electrodes is provided along afirst direction and is arranged with an interval in a second directionintersecting with the first direction in a planar view. Each of theplurality of second electrodes is provided along the second directionand is arranged with an interval in the first direction in a planarview. Each of the plurality of first electrodes includes: a plurality offirst electrode portions which are arranged with an interval in thefirst direction in a planar view; and a plurality of first connectionportions each of which electrically connects the two first electrodeportions adjacent to each other in the first direction. Each of theplurality of second electrodes includes: a plurality of second electrodeportions which are arranged with an interval in the second direction ina planar view; and a plurality of second connection portions each ofwhich electrically connects the two second electrode portions adjacentto each other in the second direction. Any one of the plurality of firstconnection portions overlaps with any one of the plurality of secondconnection portions in a planar view. Each of the plurality of firstelectrode portions contains metal or alloy, and has a mesh shape, andeach of the plurality of second electrode portions contains metal oralloy, and has a mesh shape. Additional features and advantages aredescribed herein, and will be apparent from the following DetailedDescription and the figures.

BRIEF DESCRIPTIONS OF THE FIGURES

FIG. 1 is a block diagram illustrating a configuration example of adisplay according to a first embodiment.

FIG. 2 is an explanatory diagram illustrating a state in which a fingeris in contact with or close to a touch detection device.

FIG. 3 is an explanatory diagram illustrating an example of anequivalent circuit in the state in which the finger is in contact withor close to the touch detection device.

FIG. 4 is a diagram illustrating an example of waveforms of a drivesignal and a detection signal.

FIG. 5 is a plan view illustrating an example of a module to which thedisplay according to the first embodiment is mounted;

FIG. 6 is a cross-sectional view illustrating a touch detectionfunction-equipped display device of the display according to the firstembodiment.

FIG. 7 is a circuit diagram illustrating the touch detectionfunction-equipped display device of the display according to the firstembodiment.

FIG. 8 is a perspective view illustrating a configuration example of adrive electrode and a detection electrode for touch detection in thefirst embodiment.

FIG. 9 is an explanatory diagram illustrating an electrically connectedstate of a detection electrode in a self-capacitance system.

FIG. 10 is an explanatory diagram illustrating the electricallyconnected state of the detection electrode in the self-capacitancesystem.

FIG. 11 is a plan view illustrating the drive electrode and thedetection electrode for touch detection in the first embodiment.

FIG. 12 is a cross-sectional view illustrating the drive electrode andthe detection electrode for touch detection in the first embodiment.

FIG. 13 is a plan view illustrating a drive electrode and a detectionelectrode for touch detection in a first comparative example.

FIG. 14 is a cross-sectional view illustrating the drive electrode andthe detection electrode for touch detection in the first comparativeexample.

FIG. 15 is a cross-sectional view of a light-shielding film included inthe drive electrode or the detection electrode.

FIG. 16 is a cross-sectional view during a manufacturing process of thedrive electrode and the detection electrode in the first embodiment.

FIG. 17 is a cross-sectional view during a manufacturing process of thedrive electrode and the detection electrode in the first embodiment.

FIG. 18 is a plan view illustrating a drive electrode and a detectionelectrode for touch detection in a first modification example of thefirst embodiment.

FIG. 19 is a cross-sectional view illustrating the drive electrode andthe detection electrode for touch detection in the first modificationexample of the first embodiment.

FIG. 20 is a cross-sectional view illustrating the drive electrode andthe detection electrode for touch detection in the first modificationexample of the first embodiment.

FIG. 21 is a cross-sectional view during a manufacturing process of thedrive electrode and the detection electrode in the first modificationexample of the first embodiment.

FIG. 22 is a cross-sectional view during a manufacturing process of thedrive electrode and the detection electrode in the first modificationexample of the first embodiment.

FIG. 23 is a cross-sectional view illustrating a drive electrode and adetection electrode for touch detection in a second modification exampleof the first embodiment.

FIG. 24 is a cross-sectional view illustrating the drive electrode andthe detection electrode for touch detection in the second modificationexample of the first embodiment.

FIG. 25 is a cross-sectional view during a manufacturing process of thedrive electrode and the detection electrode in the second modificationexample of the first embodiment.

FIG. 26 is a cross-sectional view during a manufacturing process of thedrive electrode and the detection electrode in the second modificationexample of the first embodiment.

FIG. 27 is a plan view illustrating a drive electrode and a detectionelectrode for touch detection in a third modification example of thefirst embodiment.

FIG. 28 is a cross-sectional view illustrating the drive electrode andthe detection electrode for touch detection in the third modificationexample of the first embodiment.

FIG. 29 is a cross-sectional view illustrating the drive electrode andthe detection electrode for touch detection in the third modificationexample of the first embodiment.

FIG. 30 is a plan view illustrating a drive electrode and a detectionelectrode for touch detection in a fourth modification example of thefirst embodiment.

FIG. 31 is a cross-sectional view illustrating the drive electrode andthe detection electrode for touch detection in the fourth modificationexample of the first embodiment.

FIG. 32 is a plan view illustrating a drive electrode and a detectionelectrode for touch detection in a second embodiment.

FIG. 33 is a cross-sectional view illustrating the drive electrode andthe detection electrode for touch detection in the second embodiment.

FIG. 34 is a cross-sectional view illustrating the drive electrode andthe detection electrode for touch detection in the second embodiment.

FIG. 35 is a cross-sectional view during a manufacturing process of thedrive electrode and the detection electrode in the second embodiment.

FIG. 36 is a cross-sectional view during a manufacturing process of thedrive electrode and the detection electrode in the second embodiment.

FIG. 37 is a cross-sectional view during a manufacturing process of thedrive electrode and the detection electrode in the second embodiment.

FIG. 38 is a cross-sectional view during a manufacturing process of adrive electrode and a detection electrode in a second comparativeexample.

FIG. 39 is a plan view illustrating a drive electrode and a detectionelectrode for touch detection in a first modification example of thesecond embodiment.

FIG. 40 is a cross-sectional view illustrating the drive electrode andthe detection electrode for touch detection in the first modificationexample of the second embodiment.

FIG. 41 is a plan view illustrating a drive electrode and a detectionelectrode for touch detection in a second modification example of thesecond embodiment.

FIG. 42 is a cross-sectional view illustrating the drive electrode andthe detection electrode for touch detection in the second modificationexample of the second embodiment.

FIG. 43 is a plan view illustrating a drive electrode and a detectionelectrode for touch detection in a third modification example of thesecond embodiment.

FIG. 44 is a cross-sectional view illustrating the drive electrode andthe detection electrode for touch detection in the third modificationexample of the second embodiment.

FIG. 45 is a diagram for describing an active shield in the thirdmodification example of the second embodiment.

FIG. 46 is a diagram for describing an active shield in the thirdmodification example of the second embodiment.

FIG. 47 is a cross-sectional view illustrating an input device accordingto the third embodiment.

DESCRIPTIONS OF THE PREFERRED EMBODIMENTS

Embodiments of the present application will be described below in detailwith reference to the drawings.

Note that the disclosures are provided by way of example, and anysuitable variations easily conceived by a person with ordinary skill inthe art while pertaining to the gist of the invention are of courseincluded in the scope of the present invention. Further, in thedrawings, widths, thicknesses and shapes of respective components may beschematically illustrated in comparison with the embodiments for thepurpose of making the description more clearly understood, but these aremerely examples, and do not limit the interpretations of the presentinvention.

Further, in the specification and drawings, elements which are similarto those already mentioned with respect to previous drawings are denotedby the same reference characters, and detailed descriptions thereof willbe suitably omitted.

Further, in a drawing employed in the embodiments, hatching that isattached for distinguishing components may be omitted depending on thedrawing.

Further, in the case where a range is indicated as A to B in thefollowing embodiment, it is assumed to be A or more and B or less exceptfor the cases where it is clearly indicated in particular.

First Embodiment

First, a description will be given regarding an example in which adisplay, which is provided with a touch panel serving as an inputdevice, is applied to a touch detection function-equipped liquid crystaldisplay having an on-cell structure as a first embodiment. Incidentally,the input device indicates an input device to detect at leastelectrostatic capacitance which changes according to capacitance of anobject that is close to or in contact with an electrode in thespecification of the present application. Here, a system to detect theelectrostatic capacitance includes not only a mutual capacitance systemthat detects electrostatic capacitance between two electrodes but also aself-capacitance system that detects electrostatic capacitance of oneelectrode. In addition, the touch detection function-equipped liquidcrystal display having the on-cell structure means a touch detectionfunction-equipped liquid crystal display characterized in that any oneof a drive electrode and a detection electrode for touch detection isirrelevant to image display using a pixel.

<Overall Configuration>

First, a description will be given regarding an overall configuration ofthe display according to the first embodiment with reference to FIG. 1.FIG. 1 is a block diagram illustrating a configuration example of thedisplay according to the first embodiment.

The display 1 is provided with a touch detection function-equippeddisplay device 10, a control unit 11, a gate driver 12, a source driver13, a drive electrode driver 14, and a touch detection unit 40.

The touch detection function-equipped display device 10 includes adisplay device 20 and a touch detection device 30. The display device 20is configured as a display device that uses a liquid crystal displayelement as a display element in this first embodiment. Accordingly, thedisplay device 20 is referred to as the liquid crystal display device 20in some cases, hereinafter. The touch detection device 30 is a touchdetection device of an electrostatic capacitive system, that is, anelectrostatic capacitive touch detection device. Thus, the display 1 isa display that is provided with the input device having a touchdetection function. In addition, the touch detection function-equippeddisplay device 10 is a display device in which the liquid crystaldisplay device 20 and the touch detection device 30 are integrated.

Incidentally, the display device 20 may be an organicelectroluminescence (EL) display device, for example, instead of thedisplay device using the liquid crystal display element.

The display device 20 performs display operation by sequentiallyscanning horizontal lines one by one in a display area according to ascan signal Vscan supplied from the gate driver 12. The touch detectiondevice 30 operates on the basis of a principle of electrostaticcapacitive touch detection, and outputs a detection signal Vdet, as willbe described later.

The control unit 11 is a circuit to supply a control signal to each ofthe gate driver 12, the source driver 13, the drive electrode driver 14,and the touch detection unit 40 based on a video signal Vdisp suppliedfrom outside, and to perform control such that the gate driver 12, thesource driver 13, the drive electrode driver 14, and the touch detectionunit 40 operate in synchronization with each other.

The gate driver 12 has a function to sequentially select one horizontalline, which is a target of display driving of the touch detectionfunction-equipped display device 10, based on the control signalsupplied from the control unit 11.

The source driver 13 is a circuit to supply a pixel signal Vpix to asubpixel SPix (see FIG. 7 to be described later), which is included inthe touch detection function-equipped display device 10, based on acontrol signal of an image signal Vsig supplied from the control unit11.

The drive electrode driver 14 is a circuit to supply a drive signalVcom1 as a drive signal Vcom to a drive electrode COML (see FIG. 6 to bedescribed later) included in the liquid crystal display device 20, andto supply a drive signal Vcom2 as the drive signal Vcom to a driveelectrode DRV (see FIG. 5 to be described later) included in the touchdetection device 30 based on the control signal supplied from thecontrol unit 11.

The touch detection unit 40 is a circuit to detect presence or absenceof touch of an input tool such as a finger and a touch pen with respectto the touch detection device 30, that is, a state in which the inputtool is in contact with or close to the touch detection device 30, whichwill be described later, based on the control signal supplied from thecontrol unit 11 and the detection signal Vdet supplied from the touchdetection device 30 of the touch detection function-equipped displaydevice 10. Further, the touch detection unit 40 is a circuit to obtain acoordinate of touch, that is, an input position of touch in a touchdetection area in the case of the presence of touch. The touch detectionunit 40 is provided with a touch detection signal amplification unit 42,an analog/digital (A/D) conversion unit 43, a signal processor 44, acoordinate extraction unit 45, and a detection timing control unit 46.

The touch detection signal amplification unit 42 amplifies the detectionsignal Vdet that is supplied from the touch detection device 30. Thetouch detection signal amplification unit 42 may be provided with alow-pass analog filter to eliminate a high-frequency component, that is,a noise component, which is included in the detection signal Vdet, andto remove and output a touch component.

<Principle of Electrostatic Capacitive Touch Detection>

Next, a description will be given regarding a principle of the touchdetection in the display 1 according to the first embodiment withreference to FIGS. 1 to 4. FIG. 2 is an explanatory diagram illustratinga state in which a finger is in contact with or close to the touchdetection device. FIG. 3 is an explanatory diagram illustrating anexample of an equivalent circuit in the state in which the finger is incontact with or close to the touch detection device. FIG. 4 is a diagramillustrating an example of waveforms of a drive signal and a detectionsignal.

As illustrated in FIG. 2, the input device, which is called a touchpanel or a touch sensor, includes a drive electrode E1 and a detectionelectrode E2 which are arranged to be opposite to each other with adielectric body D interposed therebetween in the electrostaticcapacitive touch detection. A capacitive element C1 is composed of thedrive electrode E1 and the detection electrode E2. As illustrated inFIG. 3, one end of the capacitive element C1 is connected to an ACsignal source S which is a drive signal source, and the other end of thecapacitive element C1 is connected to a voltage detector DET which is atouch detection unit. The voltage detector DET is configured using anintegration circuit, which is included in the touch detection signalamplification unit 42, illustrated in FIG. 1, for example.

When an AC square wave Sg having a frequency of about several kHz toseveral hundreds kHz, for example, is applied to one end of thecapacitive element C1, that is, to the drive electrode E1 from the ACsignal source S, the detection signal Vdet, which is an output waveform,is generated via the voltage detector DET connected to the other end ofthe capacitive element C1, that is, to the detection electrode E2 side.Incidentally, the AC square wave Sg corresponds to the drive signal Vcomillustrated in FIG. 4, for example.

As illustrated in FIG. 3, a current I1 flows in response to acapacitance value of the capacitive element C1 according to charge anddischarge with respect to the capacitive element C1 in the state inwhich the finger is not in contact or close, that is, a non-contactstate. The voltage detector DET converts fluctuation of the current I₁in response to the AC square wave Sg into fluctuation of voltage. Thisfluctuation of voltage is represented by a waveform V₀ using a solidline in FIG. 4.

On the other hand, the capacitance value of the capacitive element C1,which is formed of the drive electrode E1 and the detection electrodeE2, is decreased by being affected by electrostatic capacitance C2formed by the finger, in the state in which the finger is in contact orclose, that is, a contact state. Thus, the current I₁ flowing in thecapacitive element C1 illustrated in FIG. 3 fluctuates. The voltagedetector DET converts the fluctuation of the current I₁ in response tothe AC square wave Sg into fluctuation of voltage. This fluctuation ofvoltage is represented by a waveform V₁ using a broken line in FIG. 4.In this case, the waveform V₁ has smaller amplitude as compared to theabove-described waveform V₀. Accordingly, an absolute value |ΔV| of avoltage difference between the waveform V₀ and the waveform V₁ variesdepending on the influence of the object such as the finger thatapproaches from the outside. Incidentally, it is preferable that thevoltage detector DET be configured to operate with a period Reset inwhich charge and discharge of the capacitor is reset in accordance witha frequency of the AC square wave Sg through switching inside thecircuit in order to accurately detect the absolute value |ΔV| of thevoltage difference between the waveform V₀ and the waveform V₁.

In the example illustrated in FIG. 1, the touch detection device 30performs touch detection for each single detection block correspondingto one or a plurality of the drive electrodes DRV (see FIG. 5 or 6 to bedescribed later) according to the drive signal Vcom2 as the drive signalVcom which is supplied from the drive electrode driver 14. That is, thetouch detection device 30 outputs the detection signal Vdet for eachsingle detection block corresponding to the one or each of the pluralityof drive electrodes DRV via the voltage detector DET illustrated in FIG.3, and supplies the output detection signal Vdet to the touch detectionsignal amplification unit 42 of the touch detection unit 40.

The A/D conversion unit 43 is a circuit that performs sampling of eachanalog signal to be output from the touch detection signal amplificationunit 42 and converts the analog signal into a digital signal at timingsynchronized with the drive signal Vcom.

The signal processor 44 is provided with a digital filter that reduces afrequency component other than a frequency with which the sampling ofthe drive signal Vcom2 is performed, that is, a noise component includedin an output signal of the A/D conversion unit 43. The signal processor44 is a logic circuit that detects the presence or absence of touch withrespect to the touch detection device 30 based on the output signal ofthe A/D conversion unit 43. The signal processor 44 performs to removeonly a difference voltage generated by the finger. This differencevoltage generated by the finger is the absolute value |ΔV| of thedifference between the waveform V₀ and the waveform V₁ described above.The signal processor 44 may perform calculation to average the absolutevalue |ΔV| per single detection block, and obtain an average value ofthe absolute value |ΔV|. Accordingly, the signal processor 44 can reducethe influence caused by the noise. The signal processor 44 compares thedetected difference voltage generated by the finger with a predeterminedthreshold voltage, determines as the contact state of an externalproximity object that approaches from the outside when the detecteddifference voltage is equal to or higher than the threshold voltage, anddetermines as the non-contact state of the external proximity objectwhen the detected difference voltage is lower than the thresholdvoltage. In this manner, the touch detection in the touch detection unit40 is performed.

The coordinate extraction unit 45 is a logic circuit that obtains acoordinate of a position at which touch is detected, that is, an inputposition in the touch panel when the touch is detected in the signalprocessor 44. The detection timing control unit 46 performs control suchthat the A/D conversion unit 43, the signal processor 44, and thecoordinate extraction unit 45 operate in a synchronized manner. Thecoordinate extraction unit 45 outputs a touch panel coordinate as asignal output Vout.

<Module>

FIG. 5 is a plan view illustrating an example of a module to which thedisplay according to the first embodiment is mounted.

As illustrated in FIG. 5, the touch detection function-equipped displaydevice 10 according to the first embodiment includes a substrate 21, asubstrate 31, the plurality of drive electrodes DRV, and a plurality ofdetection electrodes TDL. The substrate 21 includes an upper surface 21a serving as a main surface, and the substrate 31 includes a lowersurface 31 a (see FIG. 6 to be described later) serving as one mainsurface and an upper surface 31 b serving as the other main surface onthe opposite side of the lower surface. Here, two directions, whichintersect with each other, and preferably are orthogonal to each otherin the upper surface 31 b of the substrate 31, are set as an X-axisdirection and a Y-axis direction. At this time, each of the plurality ofdrive electrodes DRV extends in the X-axis direction, and further, isarranged in the Y-axis direction in a planar view. In addition, each ofthe plurality of detection electrodes TDL extends in the Y-axisdirection, and further, is arranged in the X-axis direction in a planarview.

Incidentally, the expression, “in a planar view” in the specification ofthe present application means the case of being seen from a directionperpendicular to the upper surface 31 b serving as the main surface ofthe substrate 31.

In the example illustrated in FIG. 5, the touch detectionfunction-equipped display device 10 is provided with two sides, whichextend in the X-axis direction and are parallel to each other, and twosides, which extend in the Y-axis direction and are parallel to eachother, and has a rectangular shape in a planar view. Electrode terminalsET1 and ET2 are provided on one side of the touch detectionfunction-equipped display device 10 in the Y-axis direction.

The electrode terminal ET1 and the drive electrodes DRV are electricallyconnected via a routing wiring WRD. The electrode terminal ET1 iselectrically connected to a wiring substrate (not illustrated), and thewiring substrate not illustrated is connected to the drive electrodedriver 14 (see FIG. 1) which is mounted to the outside of the module.Although not illustrated, the electrode terminal ET1 is electricallyconnected to an electrode terminal that is formed in the wiringsubstrate configured using, for example, flexible printed circuits(FPC), via, for example, an anisotropically-conductive film.Accordingly, the drive electrode DRV is connected to the drive electrodedriver 14 via the routing wiring WRD, the electrode terminal ET1, andthe wiring substrate (not illustrated).

The electrode terminal ET2 and the detection electrode TDL areelectrically connected via a routing wiring WRT. The electrode terminalET2 is electrically connected to a wiring substrate (not illustrated),and the wiring substrate not illustrated is connected to the touchdetection unit 40 (see FIG. 1) which is mounted to the outside of themodule. Although not illustrated, the electrode terminal ET2 iselectrically connected to an electrode terminal that is formed in thewiring substrate composed of, for example, FPC, via, for example, ananisotropically-conductive film. Accordingly, the detection electrodeTDL is connected to the touch detection unit 40 via the routing wiringWRT, the electrode terminal ET2, and the wiring substrate (notillustrated).

The touch detection function-equipped display device 10 includes a COG19. The COG 19 is a chip which is mounted to the substrate 21 andincludes the built-in respective circuits, such as the control unit 11,the gate driver 12 and the source driver 13 illustrated in FIG. 1, whichare required for a display operation. In addition, the COG 19 mayinclude the built-in drive electrode driver 14.

It is possible to use various types of substrates which are transparentto visible light, for example, a glass substrate, or for example, a filmor the like made of resin, as the substrate 21 and the substrate 31.Incidentally, the expression, “transparent to visible light” in thespecification of the present application means that the transmittancewith respect to the visible light is equal to or higher than, forexample, 80□, and the “transmittance with respect to the visible light”means an average value of the transmittance with respect to light havinga wavelength of, for example, 380 to 780 nm. In addition, the“transmittance” means a proportion of light that transmits through asurface on the opposite side of a rear surface of the touch detectionfunction-equipped display device 10 in a display area Ad, among lightwith which the rear surface of the touch detection function-equippeddisplay device 10 (see FIG. 6 to be described later) is irradiated.

<Touch Detection Function-Equipped Display Device>

Next, a description will be given in detail regarding a configurationexample of the touch detection function-equipped display device 10 withreference to FIGS. 5 to 8. FIG. 6 is a cross-sectional view illustratingthe touch detection function-equipped display device of the displayaccording to the first embodiment. FIG. 7 is a circuit diagramillustrating the touch detection function-equipped display device of thedisplay according to the first embodiment. FIG. 8 is a perspective viewillustrating a configuration example of the drive electrode and thedetection electrode for touch detection in the first embodiment. FIG. 6is the cross-sectional view taken along a line A-A of FIG. 5.

The touch detection function-equipped display device 10 includes anarray substrate 2, a counter substrate 3, a polarizing plate 4, apolarizing plate 5, a liquid crystal layer 6, and a sealing portion 7.The counter substrate 3 is arranged to be opposite to the arraysubstrate 2 such that an upper surface, serving as a main surface, ofthe array substrate 2 and a lower surface, serving as a main surface, ofthe counter substrate 3 are opposite to each other. The polarizing plate4 is provided on the opposite side of the counter substrate 3 with thearray substrate 2 interposed therebetween. The polarizing plate 5 isprovided on the opposite side of the array substrate 2 with the countersubstrate 3 interposed therebetween. The liquid crystal layer 6 isprovided between the array substrate 2 and the counter substrate 3. Thatis, the liquid crystal layer 6 is interposed between the upper surface21 a of the substrate 21 and the lower surface 31 a of the substrate 31.The sealing portion 7 is provided between an outer peripheral part ofthe array substrate 2 and an outer peripheral part of the countersubstrate 3, and an outer peripheral part of a space between the arraysubstrate 2 and the counter substrate 3 is sealed by the sealing portion7. Further, the liquid crystal layer 6 is included in the space wherethe outer peripheral part is sealed by the sealing portion 7.

The array substrate 2 includes the substrate 21. In addition, thecounter substrate 3 includes the substrate 31. The substrate 31 includesthe lower surface 31 a serving as one main surface and the upper surface31 b serving as the other main surface on the opposite side of the lowersurface 31 a, and is arranged to be opposite to the substrate 21 suchthat the upper surface 21 a serving as the main surface of the substrate21 and the lower surface 31 a serving as the main surface of thesubstrate 31 are opposite to each other. The substrate 31 has thedisplay area Ad and a surrounding area As serving as areas of the uppersurface 31 b of the substrate 31. The surrounding area As is an areapositioned at the outer peripheral side of the substrate 31 than thedisplay area Ad.

As illustrated in FIG. 7, a plurality of scan lines GCL, a plurality ofsignal lines SGL, and TFT elements Tr which are a plurality of thin filmtransistors (TFT) are formed on the substrate 21 in the display area Ad.Incidentally, FIG. 6 does not illustrate the scan line GCL, the signalline SGL, and the TFT element Tr. In addition, the scan line means agate wiring, and the signal line means a source wiring.

As illustrated in FIG. 7, each of the plurality of scan lines GCLextends in the X-axis direction, and further, is arranged in the Y-axisdirection in the display area Ad. Each of the plurality of signal linesSGL extends in the Y-axis direction, and further, is arranged in theX-axis direction in the display area Ad. Accordingly, each of theplurality of signal lines SGL intersects with each of the plurality ofscan lines GCL in a planar view. In this manner, in a planar view, thesubpixel SPix is arranged at each intersection between the plurality ofscan lines GCL and the plurality of signal lines SGL intersecting witheach other, and a single pixel Pix is formed of a plurality of thesubpixels SPix having different colors. That is, the plurality ofsubpixels SPix are provided on the upper surface 21 a of the substrate21, and are arranged in the display area Ad to be arranged in a matrixform in the X-axis direction and the Y-axis direction in a planar view.

In a planar view, the TFT element Tr is formed at each intersectingportion at which each of the plurality of scan lines GCL and each of theplurality of signal lines SGL intersect with each other. Accordingly,the plurality of TFT elements Tr are formed on the substrate 21 in thedisplay area Ad, and the plurality of TFT elements Tr are arranged in amatrix form in the X-axis direction and the Y-axis direction. That is,the TFT element Tr is provided in each of the plurality of subpixelsSPix. In addition, a liquid crystal element LC is provided in each ofthe plurality of subpixels SPix in addition to the TFT element Tr.

The TFT element Tr is composed of the thin film transistor serving as,for example, an n-channel metal oxide semiconductor (MOS). A gateelectrode of the TFT element Tr is connected to the scan line GCL. Oneof a source electrode and a drain electrode of the TFT element Tr isconnected to the signal line SGL. The other of the source electrode andthe drain electrode of the TFT element Tr is connected to one end of theliquid crystal element LC. The liquid crystal element LC has, forexample, the one end being connected to the source electrode or thedrain electrode of the TFT element Tr and the other end being connectedto the drive electrode COML.

As illustrated in FIG. 6, the array substrate 2 includes the substrate21, the plurality of drive electrodes COML, an insulating film 24, and aplurality of pixel electrodes 22. The plurality of drive electrodes COMLare provided on the upper surface 21 a serving as one main surface ofthe substrate 21 in the display area Ad in a planar view. The insulatingfilm 24 is formed on the upper surface 21 a of the substrate 21including each surface of the plurality of drive electrodes COML. Theplurality of pixel electrodes 22 are formed on the insulating film 24 inthe display area Ad. Accordingly, the insulating film 24 electricallyinsulates the drive electrode COML from the pixel electrode 22.

As illustrated in FIG. 7, each of the plurality of pixel electrodes 22is formed inside each of the plurality of subpixels SPix arranged in thematrix form in the X-axis direction and the Y-axis direction in thedisplay area Ad in a planar view. Accordingly, the plurality of pixelelectrodes 22 are arranged in a matrix form in the X-axis direction andthe Y-axis direction.

In the example illustrated in FIG. 6, each of the plurality of driveelectrodes COML is formed between the substrate 21 and the pixelelectrode 22. In addition, each of the plurality of drive electrodesCOML is provided to overlap with the plurality of pixel electrodes 22 ina planar view, as schematically illustrated in FIG. 7. Further, an imageis displayed in the display area Ad when a voltage is applied betweeneach of the plurality of pixel electrodes 22 and each of the pluralityof drive electrodes COML, and when an electric field is formed in theliquid crystal element LC which is provided between each of theplurality of pixel electrodes 22 and each of the plurality of driveelectrodes COML, that is, in each of the plurality of subpixels SPix. Atthis time, capacitance Cap is formed between the drive electrode COMLand the pixel electrode 22, and the capacitance Cap functions as aretention capacitance.

The liquid crystal display device 20 is formed of the liquid crystalelement LC, the plurality of pixel electrodes 22, the drive electrodeCOML, the plurality of scan lines GCL, and the plurality of signal linesSGL. The liquid crystal display device 20 controls the image display inthe display area Ad by controlling the voltage that is applied betweeneach of the plurality of pixel electrodes 22 and each of the pluralityof drive electrodes COML. The liquid crystal display device 20 isprovided between the substrate 21 and the substrate 31.

Incidentally, each of the plurality of drive electrodes COML may beformed on the opposite side of the substrate 21 with the pixel electrode22 interposed therebetween. In addition, in the example illustrated inFIG. 6, the arrangement of the drive electrode COML and the pixelelectrode 22 is configured as arrangement in a fringe field switching(FFS) mode, as a horizontal electric field mode, in which the driveelectrode COML and the pixel electrode 22 overlap with each other in aplanar view. However, the arrangement of the drive electrode COML andthe pixel electrode 22 may be configured as arrangement in an in planeswitching (IPS) mode, as a horizontal electric field mode, in which thedrive electrode COML and the pixel electrode 22 do not overlap with eachother in a planar view. Alternatively, the arrangement of the driveelectrode COML and the pixel electrode 22 may be configured asarrangement in a twisted nematic (TN) mode or a vertical alignment (VA)mode as a vertical electric field mode.

The liquid crystal layer 6 modulates the light passing therethroughaccording to a state of the electric field, and is formed using a liquidcrystal layer that corresponds to the horizontal electric field mode,for example, the FFS mode or the IPS mode described above, or the like.That is, a liquid crystal display device according to the horizontalelectric field mode such as the FFS mode or the IPS mode is used as theliquid crystal display device 20. Alternatively, a liquid crystaldisplay device according to the vertical electric field mode such as theTN mode or the VA mode, as described above, may be used. Incidentally,an alignment film may be provided, respectively, between the liquidcrystal layer 6 and the array substrate 2, and between the liquidcrystal layer 6 and the counter substrate 3 illustrated in FIG. 6.

As illustrated in FIG. 7, the plurality of subpixels SPix arranged inthe X-axis direction, that is, the plurality of subpixels SPix thatbelong to the same row of the liquid crystal display device 20 areconnected to each other via the scan line GCL. The scan line GCL isconnected to the gate driver 12 (see FIG. 1), and the scan signal Vscan(see FIG. 1) is supplied thereto from the gate driver 12. In addition,the plurality of subpixels SPix arranged in the Y-axis direction, thatis, the plurality of subpixels SPix that belong to the same column ofthe liquid crystal display device 20 are connected to each other via thesignal line SGL. The signal line SGL is connected to the source driver13 (see FIG. 1), and the pixel signal Vpix (see FIG. 1) is suppliedthereto from the source driver 13. Further, the plurality of subpixelsSPix arranged in the X-axis direction, that is, the plurality ofsubpixels SPix that belong to the same row of the liquid crystal displaydevice 20 are connected to each other via the drive electrode COML.

The drive electrode COML is connected to the drive electrode driver 14(see FIG. 1), and the drive signal Vcom1 (see FIG. 1) as the drivesignal Vcom is supplied thereto from the drive electrode driver 14. Thatis, it is configured such that the plurality of subpixels SPix thatbelong to the same row share the single drive electrode COML in theexample illustrated in FIG. 7. Each of the plurality of drive electrodesCOML extends in the X-axis direction, and further, is arranged in theY-axis direction in the display area Ad. Since each of the plurality ofscan lines GCL extends in the X-axis direction, and further, is arrangedin the Y-axis direction in the display area Ad as described above, eachextending direction of the plurality of drive electrodes COML isparallel to each extending direction of the plurality of scan lines GCL.However, each extending direction of the plurality of drive electrodesCOML is not limited thereto, and, for example, each extending directionof the plurality of drive electrodes COML may be parallel to eachextending direction of the plurality of signal lines SGL.

The gate driver 12 illustrated in FIG. 1 sequentially selects one row,that is, one horizontal line of the subpixels SPix, formed in the matrixform in the liquid crystal display device 20, as a target of displaydriving by applying the scan signal Vscan to the gate electrode of theTFT element Tr of each of the subpixels SPix via the scan line GCLillustrated in FIG. 7. The source driver 13 illustrated in FIG. 1supplies the pixel signal Vpix to each of the plurality of subpixelsSPix configuring one horizontal line to be sequentially selected by thegate driver 12 via the signal line SGL illustrated in FIG. 7. Further,the display operation is performed according to the supplied pixelsignal Vpix, in the plurality of subpixels SPix configuring onehorizontal line.

The drive electrode driver 14 illustrated in FIG. 1 applies the drivesignal Vcom1 as the drive signal Vcom, and drives the drive electrodeCOML for each single detection block corresponding to the one orplurality of drive electrodes COML.

The subpixels SPix are sequentially selected for each single horizontalline in the liquid crystal display device 20 as the gate driver 12 isdriven to sequentially scan the scan lines GCL in a time divisionmanner. In addition, the display operation is performed for each singlehorizontal line in the liquid crystal display device 20 as the sourcedriver 13 supplies the pixel signal Vpix with respect to the subpixelsSPix belonging to the single horizontal line.

The drive electrode COML in the display according to the firstembodiment is a drive electrode for the display operation that operatesas a drive electrode of the liquid crystal display device 20. Meanwhile,the display according to the first embodiment includes the driveelectrode DRV serving as the drive electrode for touch detection thatoperates as a drive electrode of the touch detection device 30.

As illustrated in FIG. 8, the touch detection device 30 includes theplurality of drive electrodes DRV provided on the upper surface 31 b ofthe substrate 31 (see FIG. 6) and the plurality of detection electrodesTDL provided on the upper surface 31 b of the substrate 31. Each of theplurality of detection electrodes TDL is provided along a directionintersecting with a direction in which each of the plurality of driveelectrodes DRV is provided, in a planar view. In other words, theplurality of detection electrodes TDL are arranged to be spaced apartfrom each other so as to intersect with the plurality of driveelectrodes DRV in a planar view. Further, each of the plurality of driveelectrodes DRV is provided to overlap with each of the plurality ofdetection electrodes TDL in a planar view. Further, each of theplurality of detection electrodes TDL is connected to the touchdetection signal amplification unit 42 of the touch detection unit 40(see FIG. 1).

Electrostatic capacitance is generated between each of the plurality ofdrive electrodes DRV and each of the plurality of detection electrodesTDL. Further, the input position is detected based on the electrostaticcapacitance between each of the plurality of drive electrodes DRV andeach of the plurality of detection electrodes TDL. That is, a detectionunit to detect the input position, that is, the input device is formedof the detection electrode TDL and the drive electrode DRV.

With such a configuration, a single detection block corresponding to theone or plurality of drive electrodes DRV is sequentially selected in ascan direction Scan by the drive electrode driver 14 at the time ofperforming a touch detection operation in the touch detection device 30.Further, the drive signal Vcom2 for measurement of the electrostaticcapacitance between the drive electrode DRV and the detection electrodeTDL is input to the drive electrode DRV in the selected detection block,and the detection signal Vdet for detection of the input position isoutput from the detection electrode TDL. In this manner, the touchdetection device 30 is configured such that the touch detection isperformed for each single detection block. That is, the single detectionblock corresponds to the drive electrode E1 in the above-describedprinciple of the touch detection, and the detection electrode TDLcorresponds to the detection electrode E2.

As illustrated in FIG. 8, the plurality of drive electrodes DRV and theplurality of detection electrodes TDL, which intersect with each otherin a planar view, form an electrostatic capacitive touch sensor arrangedin in a matrix form. Accordingly, it is possible to detect a positionthat the finger or the like is in contact with or close to by scanningthe entire touch detection plane of the touch detection device 30. Thatis, the input position is detected in the mutual capacitance systembased on the electrostatic capacitance between each of the plurality ofdrive electrodes DRV and each of the plurality of detection electrodesTDL when a signal for touch detection is input to each of the pluralityof drive electrodes DRV. In other words, the input position is detectedusing a detection value of the drive electrode DRV or the detectionelectrode TDL based on the signal serving as the drive signal for touchdetection.

As illustrated in FIGS. 5 and 6, the counter substrate 3 includes thesubstrate 31, a color filter 32, the drive electrode DRV, the detectionelectrode TDL, and a protective film 33.

The substrate 31 includes the lower surface 31 a serving as the mainsurface and the upper surface 31 b serving as the main surface on theopposite side of the lower surface 31 a, as described above. The colorfilter 32 is formed on the lower surface 31 a of the substrate 31.

The drive electrode DRV and the detection electrode TDL are formed onthe upper surface 31 b of the substrate 31. The protective film 33 isformed on the upper surface 31 b of the substrate 31 so as to cover thedrive electrode DRV and the detection electrode TDL. Incidentally,shapes of the drive electrode DRV and the detection electrode TDL willbe described later.

Color filters, which are colored with three colors of, for example, red(R), green (G) and blue (B), are arranged in the X-axis direction as thecolor filter 32. Accordingly, the plurality of subpixels SPix, whichcorrespond to each of three color areas 32R, 32G and 32B of the threecolors of R, G and B, are formed, and the single pixel Pix is formed ofthe plurality of subpixels SPix corresponding to each of one set of thecolor areas 32R, 32G and 32B, as illustrated in FIG. 7. The pixels Pixare arranged in a matrix form along the extending direction (the X-axisdirection) of the scan line GCL and the extending direction (the Y-axisdirection) of the signal line SGL. In addition, a region in which thepixels Pix are arranged in the matrix form is the above-describeddisplay area Ad, for example. Incidentally, a dummy area provided with adummy pixel may be provided around the display area Ad.

The combination of colors of the color filter 32 may be a combination ofa plurality of colors including colors other than R, G and B. Inaddition, the color filter 32 is not necessarily provided.Alternatively, the single pixel Pix may include the subpixel SPix inwhich the color filter 32 is not provided, that is, the white subpixelSPix. In addition, the color filter may be provided in the arraysubstrate 2 using a color filter on array (COA) technique.

As illustrated in FIG. 6, the polarizing plate 5 is provided on theprotective film 33. Resin 34 is provided on the polarizing plate 5, anda cover plate 8 is provided on the resin 34. The cover plate 8 is bondedto the polarizing plate 5 by the resin 34.

<Touch Detection Function of Self-Capacitance System>

In the examples illustrated in FIGS. 5, 6 and 8, the description hasbeen given regarding an example in which the touch panel of the mutualcapacitance system provided with the drive electrode DRV and thedetection electrode TDL is applied as the touch panel. However, it isalso possible to apply a touch panel of the self-capacitance systemprovided only with a detection electrode TDS (see FIG. 9) as the touchpanel.

FIGS. 9 and 10 are explanatory diagrams illustrating an electricallyconnected state of a detection electrode in the self-capacitance system.

As illustrated in FIG. 9, when the detection electrode TDS havingelectrostatic capacitance Cx is disconnected from a detection circuitSC1 (corresponding to the touch detection unit 40 illustrated in FIG. 1)having electrostatic capacitance Cr1 and is electrically connected to apower supply Vdd, and a charge amount Q1 is accumulated in the detectionelectrode TDS having the electrostatic capacitance Cx in the touch panelof the self-capacitance system. Next, as illustrated in FIG. 10, whenthe detection electrode TDS having the electrostatic capacitance Cx isdisconnected from the power supply Vdd, and is electrically connected tothe detection circuit SC1 having the electrostatic capacitance Cr1, acharge amount Q2 flowing out to the detection circuit SC1 is detected.

Here, the electrostatic capacitance Cx of the detection electrode TDS ischanged due to capacitance generated by the finger in a case where thefinger is in contact with or close to the detection electrode TDS, andthe charge amount Q2 flowing out to the detection circuit SC1 is alsochanged when the detection electrode TDS is connected to the detectioncircuit SC1. Accordingly, it is possible to determine whether the fingeris in contact with or close to the detection electrode TDS by measuringthe flowing-out charge amount Q2 using the detection circuit SC1 anddetecting a change in the electrostatic capacitance Cx of the detectionelectrode TDS.

Here, it is possible to use each of the plurality of drive electrodesDRV (see FIG. 5) as the detection electrode TDS. That is, the inputposition is detected, based on each electrostatic capacitance of theplurality of drive electrodes DRV when the signal for touch detection isinput to each of the plurality of drive electrodes DRV in theself-capacitance system. In other words, the input position is detected,using the detection value of the drive electrode DRV based on the signalserving as the drive signal for touch detection.

<Shapes and Arrangement of Drive Electrode and Detection Electrode forTouch Detection>

Next, a description will be given regarding the shapes and arrangementof the drive electrode and the detection electrode for touch detection.FIG. 11 is a plan view illustrating the drive electrode and thedetection electrode for touch detection in the first embodiment. FIG. 12is a cross-sectional view illustrating the drive electrode and thedetection electrode for touch detection in the first embodiment. FIG. 12is the cross-sectional view taken along a line B-B of FIG. 11.

As the description has been given with reference to FIGS. 5 and 6described above, the counter substrate 3 in the first embodimentincludes the substrate 31, and the plurality of drive electrodes DRV andthe plurality of detection electrodes TDL which are provided on theupper surface 31 b of the substrate 31 in the display area Ad. Each ofthe plurality of drive electrodes DRV is the drive electrode of thetouch detection device 30, and each of the plurality of detectionelectrodes TDL is the detection electrode of the touch detection device30.

As illustrated in FIG. 5, each of the plurality of drive electrodes DRVis provided along the X-axis direction and is arranged with an intervalin the Y-axis direction in the display area Ad in a planar view. Each ofthe plurality of detection electrodes TDL is provided along the Y-axisdirection and is arranged with an interval in the X-axis direction inthe display area Ad in a planar view. Further, the plurality of driveelectrodes DRV intersect with the plurality of detection electrodes TDLin a planar view.

As illustrated in FIGS. 5 and 11, each of the plurality of driveelectrodes DRV includes a plurality of electrode portions EP1 and aplurality of connection portions CN1. The plurality of electrodeportions EP1 included in each of the plurality of drive electrodes DRVare formed on the upper surface 31 b of the substrate 31. The pluralityof electrode portions EP1 are arranged with an interval in the X-axisdirection in a planar view. Each of the plurality of connection portionsCN1 electrically connects the two electrode portions EP1, which areadjacent to each other in the X-axis direction, among the plurality ofelectrode portions EP1.

As illustrated in FIG. 11, each of the plurality of electrode portionsEP1 has a mesh shape formed of a plurality of conductive lines CW11 eachof which extends in a direction DR11 and a plurality of conductive linesCW12 each of which extends in a direction DR12 intersecting withdirection DR11 in a planar view. In addition, each of the plurality ofconductive lines CW11 and the plurality of conductive lines CW12 is aconductive line CW1 containing metal or alloy as the main component.Thus, the electrode portion EP1 has a light shielding property.

Incidentally, the expression, “containing metal or alloy as the maincomponent” means that the content of metal or alloy exceeds 50 wt % (%by weight).

As illustrated in FIGS. 5 and 11, each of the plurality of detectionelectrodes TDL includes a plurality of the electrode portions EP2 and aplurality of connection portions CN2. The plurality of electrodeportions EP2 and the plurality of connection portions CN2, included ineach of the plurality of detection electrodes TDL, are formed on theupper surface 31 b of the substrate 31. The plurality of electrodeportions EP2 are arranged with an interval in the Y-axis direction in aplanar view. Each of the plurality of connection portions CN2electrically connects the two electrode portions EP2, which are adjacentto each other in the Y-axis direction, among the plurality of electrodeportions EP2. Incidentally, a description will be given, hereinafter, byexemplifying a case where the connection portion CN2 is formed to beintegrated with the electrode portions EP2 on both sides thereof, butthe connection portion CN2 may be formed separately from the electrodeportions EP2 on both sides thereof. Alternatively, it may be configuredsuch that the connection portion CN2 is not provided, the two electrodeportions EP2, which are adjacent to each other in the Y-axis direction,are directly connected to each other, and the connection portion CN1 isarranged to step over part of the electrode portions EP2.

As illustrated in FIG. 11, each of the plurality of electrode portionsEP2 has a mesh shape formed of a plurality of conductive lines CW21 eachof which extends in a direction DR21 and a plurality of conductive linesCW22 each of which extends in a direction DR22 intersecting withdirection DR21 in a planar view. In addition, each of the plurality ofconductive lines CW21 and the plurality of conductive lines CW22 is aconductive line CW2 containing metal or alloy as the main component.Thus, the electrode portion EP2 has a light shielding property.

Incidentally, each of the plurality of connection portions CN2 may havea mesh shape formed of a plurality of conductive lines each of whichextends in a certain direction and a plurality of conductive lines eachof which extends in a direction intersecting with the certain directionin a planar view.

As illustrated in FIGS. 11 and 12, an insulating film IF1 is formed onthe upper surface 31 b of the substrate 31. The insulating film IF1covers a connection portion CN21, which serves as any one of theplurality of connection portions CN2 included in each of the pluralityof detection electrodes TDL. In addition, the insulating film IF1 coversnot only the connection portion CN21, but also electrode portions EP11and EP12 serving as the two electrode portions EP1, which are arrangedon both sides of the connection portion CN21 interposed therebetween andare adjacent to each other in the X-axis direction, among the pluralityof electrode portions EP1 included in each of the plurality of driveelectrodes DRV. Opening portions OP11 and OP12, which are two openingportions OP1 passing through the insulating film IF1 and reaching eachof the two electrode portions EP1, are formed on the insulating filmIF1. The opening portion OP11 passes through the insulating film IF1 andreaches the electrode portion EP11, and the opening portion OP12 passesthrough the insulating film IF1 and reaches the electrode portion EP12.

The connection portion CN11, which serves as any one of the plurality ofconnection portions CN1 included in each of the plurality of driveelectrodes DRV, is formed inside the opening portions OP11 and OP12 andon the insulating film IF1 which is positioned on the connection portionCN21.

The connection portion CN11 overlaps with the connection portion CN21 ina planar view. Meanwhile, preferably, none of the plurality of electrodeportions EP1 included in each of the plurality of drive electrodes DRVoverlaps with any one of the plurality of electrode portions EP2included in each of the plurality of detection electrodes TDL in aplanar view. Accordingly, the plurality of electrode portions EP1 andthe plurality of electrode portions EP2 can be formed on the uppersurface 31 b of the substrate 31, that is, on the same plane.

The connection portion CN11 steps over the connection portion CN21 viathe insulating film IF1 in the first embodiment. In addition, theconnection portion CN11 is electrically connected to the electrodeportion EP11 exposed at a bottom portion of the opening portion OP11,and is electrically connected to the electrode portion EP12 exposed at abottom portion of the opening portion OP12. Accordingly, the electrodeportion EP11 exposed at the bottom portion of the opening portion OP11and the electrode portion EP12 exposed at the bottom portion of theopening portion OP12 are electrically connected to each other via theconnection portion CN11 stepping over the connection portion CN21.

<Shapes and Arrangement of Drive Electrode and Detection Electrode forTouch Detection in First Comparative Example>

Here, a description will be given regarding shapes and arrangement of adrive electrode and a detection electrode for touch detection in thefirst comparative example. FIG. 13 is a plan view illustrating the driveelectrode and the detection electrode for touch detection in the firstcomparative example. FIG. 14 is a cross-sectional view illustrating thedrive electrode and the detection electrode for touch detection in thefirst comparative example. FIG. 14 is the cross-sectional view takenalong a line B-B of FIG. 13.

As with the first embodiment, the counter substrate 3 includes thesubstrate 31, the plurality of drive electrodes DRV and the plurality ofdetection electrodes TDL, which are provided on the upper surface 31 bof the substrate 31 in the display area Ad (see FIG. 5), and theprotective film 33 also in the first comparative example. In addition,as with the first embodiment, each of the plurality of drive electrodesDRV includes the plurality of electrode portions EP1 and the pluralityof connection portions CN1, and each of the plurality of detectionelectrodes TDL includes the plurality of electrode portions EP2 and theplurality of connection portions CN2 also in the first comparativeexample.

Meanwhile, each of the plurality of electrode portions EP1 is composedof a transparent conductive film formed in an integrated manner, and isnot formed using a plurality of conductive lines each of which containsmetal or alloy as the main component in the first comparative example,which is different from the first embodiment. In addition, each of theplurality of electrode portions EP2 composed of a transparent conductivefilm formed in an integrated manner, and is not formed using a pluralityof conductive lines each of which contains metal or alloy as the maincomponent in the first comparative example, which is different from thefirst embodiment.

The transparent conductive film is composed of a conductive materialhaving a light transmitting property with respect to the visible lightsuch as ITO, indium zinc oxide (IZO), or indium gallium oxide (IGO).Meanwhile, electrical resistivity of the transparent conductive film,which is composed of the conductive material having the lighttransmitting property with respect to the visible light such as the ITO,is about, for example, 10⁻² to 10⁻³ Ωcm, and is larger than electricalresistivity of a light-shield conductive film, which is composed of aconductive material having a light shielding property with respect tothe visible light such as metal or alloy, by about 100 to 1000 times,for example. Thus, it is difficult to reduce sheet resistance of thetransparent conductive film, which is composed of the conductivematerial having the light transmitting property such as the ITO, only toabout 100 to 200 Ω/square, for example while it is possible to reducesheet resistance of the light-shield conductive film, which is composedof the conductive material having the light shielding property such asmetal or alloy, to be equal to or smaller than about 10 Ω/square, forexample.

Incidentally, the expression, “having the light transmitting property,means that the transmittance with respect to the visible light is equalto or higher than 80%, for example, and the “conductive material” meansthat the electrical resistivity thereof is equal to or smaller than 10⁻³Ωcm in the specification of the present application. In addition, the“transmittance with respect to the visible light” means an average valueof the transmittance with respect to light having a wavelength of, forexample, 380 to 780 nm, and the “transmittance of the transparentconductive film” means a proportion of light that transmits even througha rear surface of the transparent conductive film among light with whicha surface of the transparent conductive film is irradiated. In addition,the expression, “having the light shielding property” means that thetransmittance with respect to the visible light is equal to or lowerthan, for example, 5%.

It is difficult to easily reduce each resistance of the drive electrodeDRV and the detection electrode TDL in the first comparative exampledescribed as above. In particular, it is difficult to reduce eachresistance of the drive electrode DRV and the detection electrode TDL inthe case of widening the display area so as to have a large screen ofthe display. Thus, it is difficult to narrow a width dimension of thedrive electrode DRV in the arrangement direction of the drive electrodeDRV, or it is difficult to narrow a width dimension of the detectionelectrode TDL in the arrangement direction of the detection electrodeTDL. Accordingly, it is difficult to improve the visibility of the driveelectrode DRV or the detection electrode TDL, or it is difficult toimprove the accuracy of touch detection in the arrangement direction ofthe drive electrode DRV or in the arrangement direction of the detectionelectrode TDL.

Main Characteristic and Effect of Present Embodiment

Meanwhile, each of the plurality of electrode portions EP1 has a meshshape formed of the plurality of conductive lines CW11 each of whichextends in the direction DR11 and the plurality of conductive lines CW12each of which extends in the direction DR12 intersecting with directionDR11 in a planar view, in the first embodiment. In addition, each of theplurality of electrode portions EP2 has a mesh shape formed of theplurality of conductive lines CW21 each of which extends in thedirection DR21 and the plurality of conductive lines CW22 each of whichextends in the direction DR22 intersecting with direction DR21 in aplanar view. Further, each of the plurality of conductive lines CW11 andthe plurality of conductive lines CW12 contains metal or alloy as themain component, and each of the plurality of conductive lines CW21 andthe plurality of conductive lines CW22 contains metal or alloy as themain component.

As described above, it is possible to reduce the sheet resistance of thelight-shield conductive film, which is composed of the conductivematerial having the light shielding property such as metal or alloy, tobe equal to or smaller than about 10 Ω/square, for example, while it ispossible to reduce the sheet resistance of the transparent conductivefilm, which is composed of the conductive material having the lighttransmitting property such as the ITO, only to about 100 to 200Ω/square, for example.

Thus, it is possible to easily reduce each resistance of the driveelectrode DRV and the detection electrode TDL in the first embodiment ascompared to the first comparative example. In particular, the effect ofeasily reducing each resistance of the drive electrode DRV and thedetection electrode TDL becomes remarkable in the case of widening thedisplay area to acquire the large screen of the display. Thus, it ispossible to narrow the width dimension of the drive electrode DRV in thearrangement direction of the drive electrode DRV, and it is possible tonarrow the width dimension of the detection electrode TDL in thearrangement direction of the detection electrode TDL. Accordingly, it ispossible to improve the visibility in the arrangement direction of thedrive electrode DRV or the arrangement direction of the detectionelectrode TDL, thereby making it possible to improve the accuracy oftouch detection.

In addition, when each of the plurality of electrode portions EP1 andthe plurality of electrode portions EP2 has a mesh shape, it is possibleto improve the visibility of an image to be displayed in the displayarea by improving the apparent transmittance.

In addition, the plurality of drive electrodes DRV and the plurality ofdetection electrodes TDL are arranged between the polarizing plate 5 andthe subpixel SPix (see FIG. 7) in the first embodiment. Further,although all the plurality of drive electrodes DRV and the plurality ofdetection electrodes TDL are irrelevant to the image display using thepixels, the touch detection device 30 (see FIG. 8) configured of theplurality of drive electrodes DRV and the plurality of detectionelectrodes TDL is arranged on the inner side than the polarizing plate5. A cell structure in this case is referred to as, for example, anon-cell structure.

A case is considered where the touch detection device 30 is arranged atan outer side than the polarizing plate 5. A cell structure in this caseis referred to a, for example, an externally mounted structure. However,when the touch detection device 30 is arranged on the outer side thanthe polarizing plate 5, all of the plurality of drive electrodes DRV andthe plurality of detection electrodes TDL are arranged on the oppositeside of the subpixels SPix (see FIG. 7) with the polarizing plate 5interposed therebetween. Thus, when each of the plurality of driveelectrodes DRV and the plurality of detection electrodes TDL has a meshshape formed of the plurality of conductive lines containing metal oralloy as the main component, the plurality of drive electrodes DRV andthe plurality of detection electrodes TDL are easily visible, and thevisibility of the image to be displayed in the display area decreases.

In addition, when the plurality of drive electrodes DRV and theplurality of detection electrodes TDL are arranged on the opposite sideof the subpixels SPix (see FIG. 7) with the polarizing plate 5interposed therebetween, it is difficult to easily synchronize thedisplay operation of the display device 20 with the touch detectionoperation using the plurality of drive electrodes DRV and the pluralityof detection electrodes TDL. Thus, the touch detection device 30 islikely to be affected by signal noise from the display device 20.

Further, when the plurality of drive electrodes DRV and the plurality ofdetection electrodes TDL are arranged on the opposite side of thesubpixels SPix (see FIG. 7) with the polarizing plate 5 interposedtherebetween, it is difficult to enhance alignment accuracy between theplurality of drive electrodes DRV and the plurality of detectionelectrodes TDL, and the color filter 32. Thus, there is a risk thatmoire is generated in a case where each of the plurality of driveelectrodes DRV and the plurality of detection electrodes TDL has a meshshape formed of the plurality of conductive lines containing metal oralloy as the main component.

Meanwhile, the plurality of drive electrodes DRV and the plurality ofdetection electrodes TDL are arranged between the polarizing plate 5 andthe subpixel SPix (see FIG. 7) in the first embodiment. Thus, thereflectance of the conductive line is halved and the visibility of theimage to be displayed in the display area is improved even in a casewhere each of the plurality of drive electrodes DRV and the plurality ofdetection electrodes TDL has a mesh shape formed of the plurality ofconductive lines containing metal or alloy as the main component.

In addition, when the plurality of drive electrodes DRV and theplurality of detection electrodes TDL are arranged between thepolarizing plate 5 and the subpixel SPix (see FIG. 7), it is possible toeasily synchronize the display operation of the display device 20 withthe touch detection operation using the plurality of drive electrodesDRV and the plurality of detection electrodes TDL. Thus, the touchdetection device 30 is hardly affected by the signal noise from thedisplay device 20.

Further, when the plurality of drive electrodes DRV and the plurality ofdetection electrodes TDL are arranged between the polarizing plate 5 andthe subpixel SPix (see FIG. 7), it is possible to enhance the alignmentaccuracy between the plurality of drive electrodes DRV and the pluralityof detection electrodes TDL, and the color filter 32. Thus, it ispossible to suppress the generation of moire even in a case where eachof the plurality of drive electrodes DRV and the plurality of detectionelectrodes TDL has a mesh shape formed of the plurality of conductivelines containing metal or alloy as the main component.

In the first embodiment, any one of the connection portions CN11 amongthe plurality of connection portions CN1 included in each of theplurality of drive electrodes DRV steps over any one of the connectionportions CN21 among the plurality of connection portions CN2 included ineach of the plurality of detection electrodes TDL via the insulatingfilm IF1. In addition, each of the plurality of connection portions CN1included in each of the plurality of drive electrodes DRV is composed ofa transparent conductive film TC1, and each of the plurality ofconnection portions CN2 included in each of the plurality of detectionelectrodes TDL composed of using a light-shielding film SF1 (see FIG. 15to be described later) containing metal or alloy as the main component.

Accordingly, the connection portion CN1 composed of the transparentconductive film TC1 steps over the connection portion CN2 composed ofthe light-shielding film SF1. That is, the electrode portions EP1 andEP2, and the connection portion CN2, which are composed of thelight-shielding film SF1, are formed, and then, the connection portionCN1 composed of the transparent conductive film is formed.

Although the transparent conductive film TC1 is composed of thetransparent conductive material such as the ITO as described above, thetransparent conductive material such as the ITO is also a metal oxidematerial, has hardness greater than hardness of metal or alloy, and haschemical stability stronger than chemical stability, such as corrosionresistance, of metal or alloy. Thus, it is possible to chemically andmechanically protect the electrode portion EP1 by covering the electrodeportion EP1, composed of the light-shielding film SF1 containing metalor alloy as the main component, with the connection portion CN1 composedof the transparent conductive film. That is, the connection portion CN1formed inside the opening portion OP1 is a protective film thatchemically and mechanically protects the electrode portion EP1 exposedat the bottom portion of the opening portion OP1. Thus, it is possibleto omit the formation of the protective film 33, as compared to thesecond modification example of the first embodiment which will bedescribed later with reference to FIGS. 23 and 24 to be described later.

In addition, the insulating film IF1 is composed of an organic film, forexample, a photosensitive resist or the like, and thus, it is possibleto prevent or suppress damage of the surface of the connection portionCN2 composed of the light-shielding film SF1 containing metal or alloyas the main component.

Incidentally, the electrode terminal ET1 composed of the light-shieldingfilm containing metal or alloy as the main component is also covered bythe transparent conductive film, for example, the ITO or the like, alsoin the electrode terminal ET1 that is connected to the electrodeterminal formed in the wiring substrate composed of, for example, theFPC in the first embodiment. Thus, it is possible to chemically andmechanically protect the electrode terminal ET1, thereby making itpossible to improve the reliability of the electrode terminal ET1.

<Blackening of Surfaces of Drive Electrode and Detection Electrode>

Next, a description will be given regarding blackening of surfaces ofthe drive electrode DRV and the detection electrode TDL. FIG. 15 is across-sectional view of the light-shielding film included in the driveelectrode or the detection electrode.

In the first embodiment, the plurality of electrode portions EP1included in each of the plurality of drive electrodes DRV, and theplurality of electrode portions EP2 and the plurality of connectionportions CN2 included in each of the plurality of detection electrodesTDL are composed of the light-shielding film SF1 containing metal oralloy as the main component.

Preferably, the light-shielding film SF1 includes a conductive film CF1and an antireflection film AN1, as illustrated in FIG. 15. Theconductive film CF1 is composed of a metal film or an alloy film whichis formed on the upper surface 31 b of the substrate 31. Theantireflection film AN1 is formed on the conductive film CF1, andprevents light from being reflected by an upper surface of theconductive film CF1. Accordingly, it is possible to prevent light frombeing reflected by each surface of the plurality of drive electrodes DRVand the plurality of detection electrodes TDL, thereby making itpossible to enhance the visibility of the image to be displayed in thedisplay area.

It is possible to use a conductive film, which includes a metal layer oran alloy layer made of one or more types of metal selected from a groupincluding molybdenum (Mo), aluminum (Al), silver (Ag), titanium (Ti),copper (Cu), chromium (Cr), and tungsten (W), the conductive filmcomposed of a film with a single layer or a plurality of layers, as theconductive film CF1.

Preferably, the antireflection film AN1 is composed of a stacked filmLF1 in which a high refractive index film HR1, a low refractive indexfilm LR1, and a high refractive index film HR2 are stacked in thisorder. Each refractive index of the high refractive index films HR1 andHR2 is higher than a refractive index of the low refractive index filmLR1. Accordingly, for example, the light incident to the antireflectionfilm AN1 is reflected by each interface of the stacked film LF1 andhardly reaches the upper surface of the conductive film CF1, or, forexample, the light reflected by the upper surface of the conductive filmCF1 is reflected by each interface of the stacked film LF1 and hardlytransmits through the antireflection film AN1, and thus, it is possibleto prevent the light from being reflected by the upper surface of theconductive film CF1.

Incidentally, each of the plurality of connection portions CN1 (see FIG.12) included in each of the plurality of drive electrodes DRV ispreferably composed of the transparent conductive film TC1, but may becomposed of the light-shielding film SF1 (see FIG. 15) as with theelectrode portion EP1 (see FIG. 12) (which is also the same in eachmodification example and a second embodiment described later).

<Method of Manufacturing Drive Electrode and Detection Electrode>

Next, a description will be given regarding a method of manufacturingthe drive electrode and the detection electrode. FIGS. 16 and 17 arecross-sectional views during a manufacturing process of the driveelectrode and the detection electrode in the first embodiment.

First, the substrate 31 is prepared as illustrated in FIG. 16. Thesubstrate 31 includes the lower surface 31 a (see FIG. 6) serving as onemain surface and the upper surface 31 b serving as the other mainsurface on the opposite side of the lower surface. In addition, thesubstrate 31 has the display area Ad and the surrounding area As (seeFIG. 5) as the areas of the upper surface 31 b of the substrate 31. Thesurrounding area As is the area on the outer peripheral side of thesubstrate 31 than the display area Ad.

Incidentally, it is possible to use various types of substrate as thesubstrate 31, for example, the transparent glass substrate, the filmmade of, for example, resin, or the like, as described above.

Next, the plurality of electrode portions EP1 and the plurality ofelectrode portions EP2 (see FIG. 11) are formed as illustrated in FIG.16. In this process, the plurality of electrode portions EP1 included ineach of the plurality of drive electrodes DRV (see FIG. 11), and theplurality of electrode portions EP2 (see FIG. 11) and the plurality ofconnection portions CN2 included in each of the plurality of detectionelectrodes TDL (see FIG. 11) are formed on the upper surface 31 b of thesubstrate 31 in the display area Ad (see FIG. 5). Incidentally, therouting wirings WRD and WRT (see FIG. 5) may be formed in thesurrounding area As.

In the process of forming the plurality of electrode portions EP1 andthe plurality of electrode portions EP2 (see FIG. 11), first, thelight-shielding film SF1 containing metal or alloy as the main componentis deposited on the entire upper surface 31 b of the substrate 31. Inthe process of depositing the light-shielding film SF1, it is possibleto deposit the light-shielding film SF1 including, for example, theconductive film CF1 (see FIG. 15) composed of the metal film or thealloy film through, for example, a sputtering method or a chemical vapordeposition (CVD) method. Preferably, it is possible to deposit theconductive film, which includes a metal layer or an alloy layer made ofone or more types of metal selected from the group including molybdenum(Mo), aluminum (Al), silver (Ag), titanium (Ti), copper (Cu), chromium(Cr), and tungsten (W), the conductive film composed of the film withthe single layer or the plurality of layers, as the conductive film CF1.

Incidentally, it is also possible to form the antireflection film AN1 onthe conductive film CF1 as described with reference to FIG. 15 describedabove.

Next, the light-shielding film SF1 is patterned. In the process ofpatterning the light-shielding film SF1, it is possible to pattern thelight-shielding film SF1 using, for example, photolithography andetching.

Accordingly, the plurality of electrode portions EP1 composed of thelight-shielding film SF1 are formed, and a plurality of electrodeportion groups EG1 including the plurality of electrode portions EP1 areformed. The plurality of electrode portion groups EG1 are arranged withan interval in the Y-axis direction, in a planar view. The plurality ofelectrode portions EP1, which are included in each of the plurality ofelectrode portion groups EG1, are arranged with an interval in theX-axis direction in a planar view.

In addition, the plurality of electrode portions EP2 (see FIG. 11)composed of the light-shielding film SF1 and the plurality of connectionportions CN2 composed of the light-shielding film SF1 are formed, andthe plurality of detection electrodes TDL including the plurality ofelectrode portions EP2 and the plurality of connection portions CN2 areformed. The plurality of detection electrodes TDL are provided along theY-axis direction, and further, arranged with an interval in the X-axisdirection in a planar view. The plurality of electrode portions EP2,included in each of the plurality of detection electrodes TDL, arearranged with an interval in the Y-axis direction in a planar view, andeach of the plurality of connection portions CN2, included in each ofthe plurality of detection electrodes TDL, electrically connects the twoelectrode portions EP2 which are adjacent to each other in the Y-axisdirection. In addition, each of the plurality of connection portions CN2is composed of the light-shielding film SF1 containing metal or alloy asthe main component, as described above.

That is, it is possible to form the plurality of electrode portions EP1,the plurality of electrode portions EP2, and the plurality of connectionportions CN2 through the same process in the first embodiment.

Next, the insulating film IF1 is formed as illustrated in FIG. 17. Inthe process of forming the insulating film IF1, the insulating film IF1,which covers the plurality of electrode portions EP1, the plurality ofelectrode portions EP2, and the plurality of connection portions CN2, isformed by coating the upper surface 31 b of the substrate 31 with a rawmaterial liquid for formation of the insulating film in the display areaAd (see FIG. 5). At this time, the insulating film IF1 covers theconnection portion CN21, which serves as any one of the plurality ofconnection portions CN2. In addition, the insulating film IF1 covers theelectrode portions EP11 and EP12 serving as the two electrode portionsEP1, which are arranged on both sides of the connection portion CN21interposed therebetween and are adjacent to each other in the X-axisdirection, among the plurality of electrode portions EP1.

It is possible to use, for example, the photosensitive resist as theinsulating film IF1, and accordingly, it is possible to easily form theopening portion OP1 using, for example, photolithography as will bedescribed later.

Next, the opening portion OP1 is formed as illustrated in FIG. 17. Inthe process of forming the opening portion OP1, the insulating film IF1,which is made of, for example, the photosensitive resist is patternedusing, for example, the photolithography. Accordingly, it is possible toform the opening portions OP11 and OP12 as the two opening portions OP1that pass through the insulating film IF1 and reach the electrodeportions EP11 and EP12, respectively, serving as the two electrodeportions EP1.

Next, the connection portion CN1 is formed as illustrated in FIG. 12.

In the process of forming the connection portion CN1, first, thetransparent conductive film TC1 is formed on the upper surface 31 b ofthe substrate 31. To be specific, the transparent conductive film TC1 isformed inside each of the two opening portions OP11 and OP12 and on theinsulating film IF1. That is, the transparent conductive film TC1 isformed on the electrode portion EP11 exposed at the bottom portion ofthe opening portion OP11, and on the electrode portion EP12 exposed atthe bottom portion of the opening portion OP12. For example, it ispossible to form the transparent conductive film TC1, composed of thetransparent conductive material such as ITO, IZO or IGO, through, forexample, the sputtering method.

Next, the transparent conductive film TC1 is patterned, and theplurality of connection portions CN1 composed of the transparentconductive film TC1 is formed In the process of forming the connectionportion CN1. Each of the plurality of connection portions CN1 iscomposed of the transparent conductive film TC1. At this time, theplurality of connection portions CN1 are formed such that the connectionportion CN11, which serves as any one of the connection portions CN1,steps over the connection portion CN21, which serves as any one of theconnection portions CN2, via the insulating film IF1. In addition, theplurality of connection portions CN1 are formed such that the connectionportion CN11 electrically connects the two electrode portions EP11 andEP12 exposed at the two opening portions OP11 and OP12, respectively.Further, the plurality of drive electrodes DRV including the pluralityof electrode portions EP1 and the plurality of connection portions CN1are formed.

Meanwhile, the substrate 21, which includes the upper surface 21 aserving as the main surface, is prepared as illustrated in FIG. 6. Inaddition, the plurality of subpixels SPix (see FIG. 7) are provided onthe upper surface 21 a of the substrate 21. Further, the substrate 21and the substrate 31 are oppositely arranged such that the upper surface21 a of the substrate 21 and the lower surface 31 a of the substrate 31are opposite to each other, as illustrated in FIG. 6. Thereafter, theliquid crystal layer 6 is included in the space between the arraysubstrate 2 including the substrate 21 and the counter substrate 3including the substrate 31, and accordingly, the display can bemanufactured.

First Modification Example of Drive Electrode and Detection Electrodefor Touch Detection

Next, a description will be given regarding a first modification exampleof the drive electrode and the detection electrode for touch detection.

FIG. 18 is a plan view illustrating a drive electrode and a detectionelectrode for touch detection in the first modification example of thefirst embodiment. FIGS. 19 and 20 are cross-sectional views illustratingthe drive electrode and the detection electrode for touch detection inthe first modification example of the first embodiment. FIG. 19 is thecross-sectional view taken along a line B-B of FIG. 18. FIG. 20illustrates a peripheral part of the opening portion OP1 in thecross-section illustrated in FIG. 19 in an enlarged manner.

Each of the plurality of drive electrodes DRV includes a plurality ofterminal portions (pedestal portions) PD1 in the first modificationexample. Each of the plurality of terminal portions PD1 is formed on theupper surface 31 b of the substrate 31, and is electrically connected toeach of the plurality of electrode portions EP1. To be specific, aterminal portion PD11 serving as the terminal portion PD1, iselectrically connected to the electrode portion EP11, and a terminalportion PD12 serving as the terminal portion PD1 is electricallyconnected to the electrode portion EP12. That is, each of the pluralityof connection portions CN1 electrically connects the two terminalportions PD1 each of which is electrically connected to each of the twoelectrode portions EP1.

As illustrated in FIG. 18, each of the plurality of electrode portionsEP1 has a mesh shape that is formed of the plurality of conductive linesCW11 and the plurality of conductive lines CW12 intersecting with eachother. In addition, a width WD1 of the terminal portion PD1 in theX-axis direction is wider than a width WD2 of the conductive line CW11in the X-axis direction and a width WD3 of the conductive line CW12 inthe X-axis direction, as illustrated in FIG. 19.

FIGS. 21 and 22 are cross-sectional views during a manufacturing processof the drive electrode and the detection electrode in the firstmodification example of the first embodiment.

In the first modification example, the plurality of electrode portionsEP1 are formed, and the plurality of electrode portion groups EG1including the plurality of electrode portions EP1 are formed, asillustrated in FIG. 21, by performing the same process as the processthat has been described with reference to FIG. 16. In addition, theplurality of electrode portions EP2 (see FIG. 18) and the plurality ofconnection portions CN2 are formed, and the plurality of detectionelectrodes TDL including the plurality of electrode portions EP2 and theplurality of connection portions CN2 are formed.

On the other hand, the plurality of terminal portions PD1 are formed inaddition to the plurality of electrode portions EP1, the plurality ofelectrode portions EP2 (see FIG. 18), and the plurality of connectionportions CN2 in the first modification example, which is different fromthe first embodiment. That is, the plurality of terminal portions PD1,each of which is electrically connected to each of the plurality ofelectrode portions EP1 included in each of the plurality of driveelectrodes DRV, are formed on the upper surface 31 b of the substrate31. To be specific, the terminal portion PD11 serving as the terminalportion PD1 is electrically connected to the electrode portion EP11, andthe terminal portion PD12 serving as the terminal portion PD1 iselectrically connected to the electrode portion EP12.

Each of the plurality of electrode portions EP1 included in each of theplurality of drive electrodes DRV has a mesh shape that is formed of theplurality of the conductive lines CW11 and the plurality of conductivelines CW12 intersecting with each other. Thus, the width WD1 of theterminal portion PD1 in the X-axis direction is wider than the width WD2of the conductive line CW11 in the X-axis direction and the width WD3 ofthe conductive line CW12 in the X-axis direction.

Next, the insulating film IF1 is formed, and the opening portion OP1 isformed, as illustrated in FIG. 22, by performing the same process as theprocess that has been described with reference to FIG. 17. In theprocess of forming the opening portion OP1, the insulating film IF1,which is made of, for example, the photosensitive resist is patternedusing, for example, the photolithography. Accordingly, it is possible toform the opening portions OP11 and OP12 serving as the two openingportions OP1 that pass through the insulating film IF1 and reach,respectively, the terminal portions PD11 and PD12 serving as the twoterminal portions PD1.

Thereafter, the plurality of connection portions CN1 are formed, asillustrated in FIG. 19, by performing the same process as that of thefirst embodiment. In this process, the plurality of connection portionsCN1 are formed such that the connection portion CN11 steps over theconnection portion CN21 via the insulating film IF1. In addition, theplurality of connection portions CN1 are formed in this process suchthat the connection portion CN11 electrically connects the electrodeportions EP11 and EP12 serving as the two electrode portions EP1, whichare arranged on both sides of the connection portion CN21 interposedtherebetween and are adjacent to each other in the X-axis direction,among the plurality of electrode portions EP1. Further, the plurality ofdrive electrodes DRV including the plurality of electrode portions EP1and the plurality of connection portions CN1 are formed.

For example, a case is considered where a side surface of the conductiveline CW1 included in the electrode portion EP1 is exposed inside theopening portion OP1, as illustrated in FIG. 17, in the process ofpatterning the insulating film IF1 made of the photosensitive resistusing the photolithography. In this case, there is a risk that corrosionof the conductive line CW1 is generated at the time of developing theinsulating film IF1 after pattern exposure using developing solution, aselectrochemical reaction with the developing solution occurs on a lowersurface of the conductive line CW1.

Meanwhile, it is possible to form the opening portion OP1 such that theopening portion OP1 is enclosed in a region in which the terminalportion PD1 is formed, in a planar view, by increasing the plane area ofthe terminal portion PD1, thereby making it possible to prevent a sidesurface of the terminal portion PD1 from being exposed at the bottomportion of the opening portion OP1 in the first modification example.Thus, it is possible to prevent or suppress the generation of corrosionof the terminal portion PD1 at the time of developing the insulatingfilm IF1 after pattern exposure using the developing solution in theprocess of patterning the insulating film IF1 made of, for example, thephotosensitive resist using the photolithography.

A case is considered where the light-shielding film SF1 includes theconductive film CF1 and the stacked film LF1 formed on the conductivefilm CF1, the reflection of light on the upper surface of the conductivefilm CF1 is prevented or suppressed using the interference of lightreflected by each layer boundary of the stacked film LF1, and thesurface of the light-shielding film SF1 is blackened as described withreference to FIG. 15 described above. In this case, a condition ofinterference that is required for the blackening is not satisfied wherethe connection portion CN1, composed of the transparent conductive filmTC1, is stacked on the electrode portion EP1 composed of thelight-shielding film SF1, and thus there is a risk that a color tone isdeviated from black, or the reflectance of light on the upper surface ofthe light-shielding film SF1 increases.

Accordingly, it is preferable that the light-shielding film SF1 includethe conductive film CF1 and an absorbing film AF1, which is formed onthe conductive film CF1 and made of resin having a black color, asillustrated in FIG. 20, for example, in the first embodiment includingthe first modification example and the following respective modificationexamples. Accordingly, even in a case where the connection portion CN1composed of the transparent conductive film TC1 is stacked on theelectrode portion EP1 composed of the light-shielding film SF1, it ispossible to prevent or suppress the deviation of the color tone fromblack, and the increase of the reflectance of light on the upper surfaceof the light-shielding film SF1.

Second Modification Example of Drive Electrode and Detection Electrodefor Touch Detection

Next, a description will be given regarding the second modificationexample of the drive electrode and the detection electrode for touchdetection.

FIGS. 23 and 24 are cross-sectional views illustrating a drive electrodeand a detection electrode for touch detection in the second modificationexample of the first embodiment. Incidentally, a plan view illustratingthe drive electrode and the detection electrode for touch detection inthe second modification example is the same as the plan viewillustrating the drive electrode and the detection electrode for touchdetection in the first embodiment, which has been described withreference to FIG. 11 described above, and FIG. 23 is the cross-sectionalview taken along the line B-B of FIG. 11, and illustrates across-section corresponding to one of the connection portions CN1. Inaddition, FIG. 24 is the cross-sectional view taken along a line C-C ofFIG. 11, and illustrates a cross-section corresponding to two of theconnection portions CN1.

In the second modification example, the insulating film IF1 to cover theconnection portion CN2 is formed through a method of ejecting a rawmaterial liquid for formation of an insulating film as droplets, such asan ink jet method or an electric field jet method. Thus, the insulatingfilm IF1 to cover the electrode portion EP1 is not necessarily formed.Further, the plurality of connection portions CN1 are formed such thatthe connection portion CN11, which serves as any one of the connectionportions CN1, steps over the connection portion CN21, which serves asany one of the connection portions CN2, via the insulating film IF1. Inaddition, the plurality of connection portions CN1 are formed such thatthe connection portion CN11 electrically connects the electrode portionsEP11 and EP12 serving as the two electrode portions EP1, which arearranged on both sides of any one of the connection portions CN2interposed therebetween and are adjacent to each other in the X-axisdirection, among the plurality of electrode portions EP1.

Since part of the electrode portions EP1 or part of the electrodeportions EP2 are covered by neither the insulating film IF1 nor thetransparent conductive film TC1 in the second modification example, theprotective film 33, which covers the electrode portions EP1 and EP2 (seeFIG. 11), the connection portions CN1 and CN2, and the insulating filmIF1, is formed on the upper surface 31 b of the substrate 31.

FIGS. 25 and 26 are cross-sectional views during a manufacturing processof the drive electrode and the detection electrode in the secondmodification example of the first embodiment.

In the second modification example, the plurality of electrode portionsEP1, the plurality of electrode portions EP2, and the plurality ofconnection portions CN2 are formed, and the plurality of detectionelectrodes TDL including the plurality of electrode portions EP2 and theplurality of connection portions CN2 are formed by performing the sameprocess as the process that has been described with reference to FIG.16. Thereafter, the insulating film IF1 is formed as illustrated in FIG.25. In the process of forming the insulating film IF1, the upper surface31 b of the substrate 31 in the display area Ad is coated with the rawmaterial liquid for formation of the insulating film by ejecting theliquid as droplets through the ink-jet method or the electric field jetmethod, and accordingly, a plurality of the insulating films IF1 thatcover the connection portion CN21 serving as any one of the plurality ofconnection portions CN2, are formed. At this time, the electrodeportions EP11 and EP12, serving as the two electrode portions EP1, whichare arranged on both sides of the connection portion CN21 interposedtherebetween and are adjacent to each other in the X-axis direction,among the plurality of electrode portions EP1, are not covered by theinsulating film IF1, but exposed from the insulating film IF1.

It is possible to form a resin film, which is made of a UV curable resinor a thermosetting resin such as an acrylic resin, an epoxy resin, or apolyimide resin, as the insulating film IF1. Accordingly, it is possibleto use a raw material liquid containing the above-described UV curableresin or thermosetting resin as the raw material liquid for formation ofthe insulating film.

For example, when the raw material liquid is applied through the ink-jetmethod, the droplets of the raw material liquid are ejected toward theupper surface 31 b of the substrate 31 from a nozzle provided in anozzle head (not illustrated), which is provided so as to be relativelymovable with respect to the substrate 31, by relatively moving thenozzle head in a certain direction with respect to the substrate 31.Accordingly, a coating film is formed by coating the display area Adwith the raw material liquid.

Thereafter, the applied coating film is cured to form the insulatingfilm IF1. In a case where a raw material liquid containing the UVcurable resin is used as the raw material liquid, the applied coatingfilm is irradiated with light of UV, that is, UV light to cure thecoating film. Alternatively, in a case where a raw material liquidcontaining the thermosetting resin is used as the raw material liquid,the applied coating film is subjected to heat treatment to cure thecoating film. Accordingly, the insulating film IF1, which includes aplurality of dots which are formed as the droplets ejected from thenozzle land on the upper surface 31 b of the substrate 31, is formed,and the plurality of insulating films IF1 that covers each of theplurality of connection portions CN2 are formed in the display area Ad.

In a case where the raw material liquid is applied through the method ofejecting the raw material liquid for formation of the insulating film asthe droplets, it is unnecessary to perform photolithography and etchingin order for patterning, and thus, it is possible to form the insulatingfilm IF1 having a desired pattern without increasing the number ofmanufacturing processes. In addition, it is unnecessary to prepare aphotomask in order for patterning in a case where the raw materialliquid is applied through the method of ejecting the raw material liquidfor formation of the insulating film as the droplets, and thus, it ispossible to reduce a manufacturing cost. In addition, it is possible toefficiently use the raw material liquid in a case where the raw materialliquid is applied through the method of ejecting the raw material liquidfor formation of the insulating film as the droplets, and thus, it ispossible to reduce the manufacturing cost. Further, it is possible todeposit the film under atmospheric pressure, and it is unnecessary toprepare a film deposition device provided with a vacuum chamber in acase where the raw material liquid is applied through the method ofejecting the raw material liquid for formation of the insulating film asthe droplets, and thus, it is possible to downsize the film depositiondevice.

Next, the transparent conductive film TC1 is formed on the upper surface31 b of the substrate 31, the transparent conductive film TC1 ispatterned, and the plurality of connection portions CN1, composed of thetransparent conductive film TC1, are formed, as illustrated in FIG. 23,by performing the same process as the process that has been describedwith reference to FIG. 12.

At this time, the transparent conductive film TC1 is formed on each ofthe plurality of electrode portions EP1 in a process of forming thetransparent conductive film TC1. In addition, the plurality ofconnection portions CN1 are formed such that the connection portion CN11steps over the connection portion CN21 via the insulating film IF1 in aprocess of forming the plurality of connection portions CN1. Inaddition, the plurality of connection portions CN1 are formed such thatthe connection portion CN11 electrically connects the electrode portionsEP11 and EP12 serving as the two electrode portions EP1, which arearranged on both sides of the connection portion CN21 interposedtherebetween and are adjacent to each other in the X-axis direction,among the plurality of electrode portions EP1. Further, the plurality ofdrive electrodes DRV including the plurality of electrode portions EP1and the plurality of connection portions CN1 are formed.

Thereafter, the protective film 33, which covers the electrode portionsEP1 and EP2 (see FIG. 11), the connection portions CN1 and CN2, and theinsulating film IF1, is formed on the upper surface 31 b of thesubstrate 31 in the second modification example, as illustrated in FIG.23, which is different from the first embodiment.

As described above with reference to FIG. 17, for example, a case isconsidered where the side surface of the conductive line CW1 included inthe electrode portion EP1 is exposed inside the opening portion OP1 inthe process of patterning the insulating film IF1 made of thephotosensitive resist using the photolithography. In this case, there isa risk that the corrosion of the conductive line CW1 is generated at thetime of developing the insulating film IF1 after pattern exposure usingthe developing solution, as the electrochemical reaction with thedeveloping solution occurs mainly on the lower surface of the conductiveline CW1. Thus, there is a need to form the terminal portion PD1 (seeFIG. 18) in some cases depending on the material of the light-shieldingfilm SF1 (see FIG. 15), as described in the first modification exampleof the first embodiment.

On the other hand, it is unnecessary to develop the insulating film IF1using the developing solution since the insulating film IF1 is formedthrough the ink-jet method or the electric field jet method in thesecond modification example. Thus, it is possible to prevent thegeneration of corrosion of the conductive line CW1, caused by thedeveloping solution, in the process of forming the insulating film IF1.Thus, it is unnecessary to form the terminal portion PD1 regardless ofthe material of the light-shielding film SF1 (see FIG. 15).

Third Modification Example of Drive Electrode and Detection Electrodefor Touch Detection

Next, a description will be given regarding the third modificationexample of the drive electrode and the detection electrode for touchdetection.

FIG. 27 is a plan view illustrating a drive electrode and a detectionelectrode for touch detection in the third modification example of thefirst embodiment. FIGS. 28 and 29 are cross-sectional views illustratingthe drive electrode and the detection electrode for touch detection inthe third modification example of the first embodiment. FIGS. 28 and 29are the cross-sectional views taken along a line C-C of FIG. 27.

In the third modification example, an electrode portion EP3, whichcovers any one of the plurality of electrode portions EP1 included ineach of the plurality of drive electrodes DRV, is formed on the uppersurface 31 b of the substrate 31, as illustrated in FIG. 28. Theelectrode portion EP3 is electrically connected to the connectionportion CN1, and further, is electrically connected to the electrodeportion EP1. In addition, the electrode portion EP3 is formed on any oneof the electrode portions EP1. The electrode portion EP3 is composed ofa transparent conductive film TC2. The electrode portion EP3 may beformed to be integrated with the connection portion CN1.

Accordingly, it is possible to improve the conductivity of the driveelectrode DRV, to increase the capacitance between the drive electrodeDRV and the detection electrode TDL in the mutual capacitance system,and to increase the capacitance of the drive electrode DRV or thedetection electrode TDL in the self-capacitance system. Thus, it ispossible to improve the detection sensitivity of touch detection in thetouch detection device.

Incidentally, two electrode portions EP4, which cover the respectiveelectrode portions EP2 adjacent to each other in the X-axis direction,may be formed on the upper surface 31 b of the substrate 31 (see FIG.28), as illustrated in FIG. 27, and the two electrode portions EP4 maybe electrically connected with each other via a connection portion CN3.The two electrode portions EP4 and the connection portion CN3 may beformed in an integrated manner, and may be composed of the transparentconductive film, as with the connection portion CN1. Accordingly, thetwo detection electrodes TDL, which are adjacent to each other in theX-axis direction, are electrically connected to each other, and thus, itis possible to improve the detection sensitivity of touch detection inthe touch detection device although the positional accuracy of the touchdetection decreases in the X-axis direction.

In addition, an insulating film IF2, which is formed to be integratedwith the insulating film IF1 to cover the connection portion CN2, maycover the electrode portion EP1, as illustrated in FIG. 29. In addition,it may be configured such that an opening portion OP3, which passesthrough the insulating film IF2 and reaches the conductive line CW11 orCW12 included in the electrode portion EP1, is formed in the insulatingfilm IF2, and the electrode portion EP3 is formed inside the openingportion OP3 and on the insulating film IF2. Further, the two electrodeportions EP3, which are adjacent to each other in the X-axis direction,may be electrically connected with each other via the connection portionCN1, as with the example illustrated in FIG. 27. In addition, the twoelectrode portions EP3, which are adjacent to each other in the X-axisdirection, and the connection portion CN1, which electrically connectsthese two electrode portions EP3 with each other, may be formed in anintegrated manner. In this case, also, it is possible to improve theconductivity of the drive electrode DRV, thereby making it possible toimprove the detection sensitivity of touch detection in the touchdetection device.

Fourth Modification Example of Drive Electrode and Detection Electrodefor Touch Detection

Next, a description will be given regarding the fourth modificationexample of the drive electrode and the detection electrode for touchdetection.

FIG. 30 is a plan view illustrating a drive electrode and a detectionelectrode for touch detection in the fourth modification example of thefirst embodiment. FIG. 31 is a cross-sectional view illustrating thedrive electrode and the detection electrode for touch detection in thefourth modification example of the first embodiment. FIG. 31 is thecross-sectional view taken along a line C-C of FIG. 30.

In the fourth modification example, an insulating film IF3, which coversany one of the plurality of electrode portions EP1 included in each ofthe plurality of drive electrodes DRV, is formed on the upper surface 31b of the substrate 31, as illustrated in FIG. 31. In addition, theelectrode portion EP3 is formed on any one of the electrode portions EP1via the insulating film IF3. The electrode portion EP3 is composed of atransparent conductive film TC2.

In the fourth modification example, the electrode portion EP3 is in anelectrically floating state, that is, in a floating state, and iselectrically connected to none of the electrode portions EP1 and EP2(see FIG. 30), and of the connection portions CN1 and CN2, which isdifferent from the third modification example of the first embodiment.

Accordingly, it is possible to adjust distribution of the electric fieldaround the electrode portion EP1, to increase the capacitance betweenthe drive electrode DRV and the detection electrode TDL in the mutualcapacitance system, and to increase the capacitance of the driveelectrode DRV or the detection electrode TDL in the self-capacitancesystem. Thus, it is possible to improve the detection sensitivity oftouch detection in the touch detection device.

Incidentally, an insulating film (not illustrated), which covers theelectrode portion EP2, is formed on the upper surface 31 b of thesubstrate 31 as illustrated in FIG. 30, and an electrode portion EP4 inthe electrically floating state may be formed on this insulating filmnot illustrated. In this case, it is possible to adjust the distributionof the electric field around the electrode portion EP2.

In addition, when the signal for touch detection is input to any one ofthe electrode portions EP1, a signal for active shield having the samepotential or the same phase as that of the signal for touch detectionmay be input to the electrode portion EP3 formed on any one of theelectrode portions EP1 via the insulating film IF3 in the fourthmodification example, as with the third modification example of thesecond embodiment that will be described later. Accordingly, it ispossible to reduce the influence of the noise from the liquid crystaldisplay device at the time of touch detection, thereby making itpossible to improve the detection sensitivity of touch detection in thetouch detection device.

Second Embodiment

The example has been described in the first embodiment in which theconnection portion CN1 composed of the transparent conductive film stepsover the connection portion CN2 composed of the light-shielding filmcontaining metal or alloy as the main component. On the other hand, adescription will be given in a second embodiment regarding an example inwhich the connection portion CN2, composed of the light-shielding filmcontaining metal or alloy as the main component, steps over theconnection portion CN1 composed of the transparent conductive film.

Each part of a display according to the second embodiment, other thanthe drive electrode DRV and the detection electrode TDL, is the same aseach part of the display according to the first embodiment, other thanthe drive electrode DRV and the detection electrode TDL, and thus, thedescription thereof will be omitted.

<Shapes and Arrangement of Drive Electrode and Detection Electrode forTouch Detection>

FIG. 32 is a plan view illustrating a drive electrode and a detectionelectrode for touch detection in a second embodiment. FIGS. 33 and 34are cross-sectional views illustrating the drive electrode and thedetection electrode for touch detection in the second embodiment. FIG.33 is the cross-sectional view taken along a line B-B of FIG. 32, andillustrates a cross-section corresponding to one of the connectionportions CN1. In addition, FIG. 34 is the cross-sectional view takenalong a line C-C of FIG. 32, and illustrates a cross-sectioncorresponding to two of the connection portions CN1.

As with the first embodiment, the counter substrate 3 includes thesubstrate 31, and the plurality of drive electrodes DRV and theplurality of detection electrodes TDL, which are provided on the uppersurface 31 b of the substrate 31 in the display area Ad, also in thesecond embodiment. In addition, as with the first embodiment, each ofthe plurality of drive electrodes DRV includes the plurality ofelectrode portions EP1 and the plurality of connection portions CN1, andeach of the plurality of detection electrodes TDL includes the pluralityof electrode portions EP2 and the plurality of connection portions CN2,also in the second embodiment.

Meanwhile, the plurality of connection portions CN1 included in each ofthe plurality of drive electrodes DRV are formed on the upper surface 31b of the substrate 31 without passing through the insulating film IF1and the connection portion CN2 in the second embodiment, which isdifferent from the first embodiment. The plurality of connectionportions CN1 are arranged with an interval in the X-axis direction.Accordingly, the insulating film IF1 is formed on the connection portionCN1 in the second embodiment, which is different from the firstembodiment. In other words, the insulating film IF1 is formed on theupper surface 31 b of the substrate 31 so as to cover the connectionportion CN11, which serves as any one of the plurality of connectionportions CN1. The insulating film IF1 is formed through, for example,the ink-jet method or the electric field jet method, as with the secondmodification example of the first embodiment.

As illustrated in FIGS. 32 and 33, the connection portion CN21, whichserves as any one of the plurality of connection portions CN2 includedin each of the plurality of detection electrodes TDL, is formed on theconnection portion CN11, which serves as any one of the plurality ofconnection portions CN1 included in each of the plurality of driveelectrodes DRV, via the insulating film IF1.

As with the first embodiment, the plurality of electrode portions EP1included in each of the plurality of drive electrodes DRV, and theplurality of electrode portions EP2 and the plurality of connectionportions CN2 included in each of the plurality of detection electrodesTDL are formed on the upper surface 31 b of the substrate 31, also inthe second embodiment. Accordingly, the electrode portions EP11 andEP12, serving as the two electrode portions EP1, which are arranged onboth sides of the connection portion CN21 interposed therebetween andare adjacent to each other in the X-axis direction, among the pluralityof electrode portions EP1 included in each of the plurality of driveelectrodes DRV, are formed on the upper surface 31 b of the substrate31.

As illustrated in FIG. 32, each of the plurality of electrode portionsEP1 has a mesh shape formed of the plurality of conductive lines CW11each of which extends in the direction DR11 and the plurality ofconductive lines CW12 each of which extends in the direction DR12intersecting with direction DR11 in a planar view. In addition, each ofthe plurality of conductive lines CW11 and the plurality of conductivelines CW12 contains metal or alloy as the main component.

Part of the electrode portion EP11 are formed on the connection portionCN11, and part of the electrode portions EP12 are formed on theconnection portion CN11. In this manner, the electrode portions EP11 andEP12 are electrically connected with each other via the connectionportion CN11. That is, each of the plurality of connection portions CN1included in each of the plurality of drive electrodes DRV electricallyconnects the two electrode portions EP1, which are adjacent to eachother in the X-axis direction, among the plurality of electrode portionsEP1 included in each of the plurality of drive electrodes DRV.

Incidentally, each of the plurality of connection portions CN2 includedin each of the plurality of detection electrodes TDL electricallyconnects the two electrode portions EP2, which are adjacent to eachother in the Y-axis direction, among the plurality of electrode portionsEP2 included in each of the plurality of detection electrodes TDL.

Since part of the electrode portions EP1 or part of the electrodeportions EP2 are covered by neither the insulating film IF1 nor thetransparent conductive film in the second embodiment, the protectivefilm 33, which covers the electrode portions EP1 and EP2, the connectionportions CN1 and CN2, and the insulating film IF1, is formed on theupper surface 31 b of the substrate 31, as with the second modificationexample of the first embodiment.

Main Characteristic and Effect of Present Embodiment

The display according to the second embodiment has the same effect asthat of the display according to the first embodiment since each of theplurality of electrode portions EP1 and the plurality of electrodeportions EP2 contains metal or alloy as the main component, and further,has a mesh shape, as with the display according to the first embodiment.

In addition, the display according to the second embodiment has the sameeffect as that of the display according to the first embodiment sincethe input device having the on-cell structure is provided and the inputdevice having the externally mounted structure is not provided, as withthe display according to the first embodiment.

Meanwhile, any one of the connection portions CN21 among the pluralityof connection portions CN2 included in each of the plurality ofdetection electrodes TDL steps over any one of the connection portionsCN11 among the plurality of connection portions CN1 included in each ofthe plurality of drive electrodes DRV via the insulating film IF1 in thesecond embodiment, which is different from the first embodiment. Inaddition, each of the plurality of connection portions CN1 included ineach of the plurality of drive electrodes DRV is composed of thetransparent conductive film TC1, and each of the plurality of connectionportions CN2 included in each of the plurality of detection electrodesTDL is composed of the light-shielding film SF1 containing metal oralloy as the main component (see FIG. 15).

Accordingly, the connection portion CN2 composed of the light-shieldingfilm SF1 steps over the connection portion CN1 composed of thetransparent conductive film TC1 in the second embodiment, which isdifferent from the first embodiment. That is, the connection portion CN1composed of the transparent conductive film TC1 is formed, and then, theelectrode portions EP1 and EP2, and the connection portion CN2, whichare composed of the light-shielding film SF1, are formed.

In this case, the electrode portions EP1 and EP2, and the connectionportion CN2, which are composed of the light-shielding film SF1 (seeFIG. 15), are formed after the insulating film IF1 is formed, which willbe described with reference to FIGS. 36 and 37 to be described later.Thus, it is possible to prevent generation of corrosion of thelight-shielding film SF1, caused by developing solution, in the processof forming the insulating film IF1. Thus, it is unnecessary to form theterminal portion PD1 (see FIG. 18) regardless of the material of thelight-shielding film SF1.

<Blackening of Surfaces of Drive Electrode and Detection Electrode>

A case is considered where the light-shielding film SF1 includes theconductive film CF1 and the antireflection film AN1, which is composedof the stacked film LF1 formed on the conductive film CF1, thereflection of light on the upper surface of the conductive film CF1 isprevented or suppressed using the interference of light reflected byeach layer boundary of the stacked film LF1, and the surface of thelight-shielding film SF1 is blackened, as described with reference toFIG. 15 described above. In this case, when the protective film 33 isformed in the second modification example of the first embodiment, whichhas been described with reference to FIG. 23 described above, thetransparent conductive film TC1 and the protective film 33 are stackedon the light-shielding film SF1. Then, a condition of interference thatis required for the blackening is not satisfied where the transparentconductive film TC1 and the protective film 33 are stacked on thelight-shielding film SF1, and thus there is a risk that the color toneis deviated from black, or the reflectance of light on the upper surfaceof the conductive film CF1 increases.

Alternatively, even when the protective film 33 is not formed, thecondition of interference that is required for the blackening is notsatisfied where the connection portion CN1, composed of the transparentconductive film, is stacked on the electrode portion EP1 composed of thelight-shielding film SF1, and thus there is a risk that the color toneis deviated from black, or the reflectance of light on the upper surfaceof the conductive film CF1 increases.

On the other hand, the connection portion CN1, composed of thetransparent conductive film TC1, is not stacked on the light-shieldingfilm SF1 as the electrode portions EP1 and EP2, and the connectionportion CN2, which are composed of the light-shielding film SF1, areformed after forming the connection portion CN1 composed of thetransparent conductive film TC1 in the second embodiment, which isdifferent from the first embodiment. Thus, it is possible to prevent orsuppress the deviation of the color tone from black, and to furtherprevent or suppress the increase of the reflectance of light on theupper surface of the conductive film CF1, even in a case where thelight-shielding film SF1 includes the conductive film CF1 and thestacked film LF1 formed on the conductive film CF1.

A portion, which is greatly affected when the color tone is deviatedfrom black, between the connection portion CN1 composed of thetransparent conductive film TC1 and the protective film 33 is theconnection portion CN1 composed of the transparent conductive film TC1.Thus, although the protective film 33 is stacked on the light-shieldingfilm SF1 in the second embodiment, it is possible to prevent or suppressthe deviation of the color tone from black, and to prevent or suppressthe increase of the reflectance of light on the upper surface of theconductive film CF1 as compared to the second modification example ofthe first embodiment.

<Method of Manufacturing Drive Electrode and Detection Electrode>

Next, a description will be given regarding a method of manufacturingthe drive electrode and the detection electrode. FIGS. 35 to 37 arecross-sectional views during a manufacturing process of the driveelectrode and the detection electrode in the second embodiment.

In the second embodiment, the substrate 31 is prepared by performing thesame process as the process that has been described with reference toFIG. 16, and the connection portion CN1 is formed, as illustrated inFIG. 35.

In the process of forming the connection portion CN1, first, thetransparent conductive film TC1 is formed on the upper surface 31 b ofthe substrate 31 in the display area Ad (see FIG. 5) by performing thesame process as the process that has been described with reference toFIG. 12.

Next, in the process of forming the connection portion CN1, thetransparent conductive film TC1 is patterned, and the plurality ofconnection portions CN1 included in each of the plurality of driveelectrodes DRV are formed on the upper surface 31 b of the substrate 31.Each of the plurality of connection portions CN1 is composed of thetransparent conductive film TC1. The plurality of connection portionsCN1 are arranged with an interval in the X-axis direction. Incidentally,the connection portion CN11, which serves as any one of the plurality ofconnection portions CN1, is illustrated in FIG. 35.

Next, the insulating film IF1 is formed, as illustrated in FIG. 36, byperforming the same process as the process that has been described withreference to FIG. 25. In the process of the insulating film IF1, theupper surface 31 b of the substrate 31 in the display area Ad is coatedwith the raw material liquid for formation of the insulating film byejecting the liquid as droplets through the ink-jet method or theelectric field jet method, and accordingly, the plurality of insulatingfilms IF1 that cover the connection portion CN11 are formed. It ispossible to form a resin film, which is made of a UV curable resin or athermosetting resin such as an acrylic resin, an epoxy resin, or apolyimide resin, as the insulating film IF1.

Next, the plurality of electrode portions EP1 and the plurality ofelectrode portions EP2 are formed, as illustrated in FIG. 37, byperforming the same process as the process that has been described withreference to FIG. 16. In the process of forming the plurality ofelectrode portions EP1 and the plurality of electrode portions EP2, theplurality of electrode portions EP1, the plurality of electrode portionsEP2 (see FIG. 32), and the plurality of connection portions CN2 areformed on the upper surface 31 b of the substrate 31 in the display areaAd (see FIG. 5). Further, the plurality of drive electrodes DRVincluding the plurality of electrode portions EP1 and the plurality ofconnection portions CN1 are formed, and the plurality of detectionelectrodes TDL including the plurality of electrode portions EP2 and theplurality of connection portions CN2 are formed. That is, the pluralityof electrode portions EP1 included in each of the plurality of driveelectrodes DRV, and the plurality of electrode portions EP2 and theplurality of connection portions CN2 included in each of the pluralityof detection electrodes TDL are formed in this process. Each of theconnection portions CN2 is composed of the light-shielding film SF1containing metal or alloy as the main component.

In this process, the plurality of electrode portions EP1, which arearranged with an interval in the X-axis direction in a planar view, areformed on the upper surface 31 b of the substrate 31. In addition, theplurality of electrode portions EP2, which are arranged with an intervalin the Y-axis direction in a planar view, are formed on the uppersurface 31 b of the substrate 31, and each of the plurality ofconnection portions CN2, which electrically connects the two electrodeportions EP2 adjacent to each other in the Y-axis direction, is formed.

At this time, the plurality of electrode portions EP1 are formed suchthe respective two electrode portions EP1 adjacent to each other in theX-axis direction are electrically connected with each other via each ofthe plurality of connection portions CN1. In addition, the plurality ofconnection portions CN2 are formed such that the connection portionCN21, which serves as any one of the plurality of connection portionsCN2, steps over the connection portion CN11, which serves as any one ofthe plurality of connection portions CN1, via the insulating film IF1.In addition, the plurality of connection portions CN2 are formed suchthat the connection portion CN21 electrically connects the two electrodeportions EP2, which are arranged on both sides of the connection portionCN11 interposed therebetween and are adjacent to each other in theY-axis direction, among the plurality of electrode portions EP2.

Thereafter, the protective film 33, which covers the electrode portionsEP1 and EP2 (see FIG. 32), the connection portions CN1 and CN2, and theinsulating film IF1, is formed on the upper surface 31 b of thesubstrate 31, as illustrated in FIG. 33, in the second embodiment, whichis different from the first embodiment.

FIG. 38 is a cross-sectional view during a manufacturing process of adrive electrode and a detection electrode in the second comparativeexample. FIG. 38 illustrates a peripheral part of the conductive lineCW1 (see FIG. 32) in an enlarged manner.

In the second comparative example, the electrode portions EP1 and EP2(see FIG. 32) and the connection portion CN2 (see FIG. 32), which arecomposed of the light-shielding film SF1 containing metal or alloy asthe main component, are formed, the insulating film IF1 made of, forexample, the photosensitive resist is formed, and then, the openingportion OP1 is formed by patterning the insulating film IF1 using thephotolithography. In this case, when the opening portion OP1 is notenclosed in the region in which the terminal portion PD1 (see FIG. 18)is formed, the side surface of the conductive line CW1, which isincluded in the electrode portion EP1 and composed of thelight-shielding film SF1, is exposed from the insulating film IF1 at thetime of developing the insulating film IF1 after pattern exposure usingthe developing solution. Thus, there is a risk that the corrosion of theconductive line CW1 is generated, as the electrochemical reaction withthe developing solution occurs mainly on the lower surface of theconductive line CW1.

Alternatively, it is necessary to allow the opening portion OP1 to beenclosed in the region in which the terminal portion PD1 is formed, in aplanar view, by forming the terminal portion PD1 and increasing theplane area of the terminal portion PD1, in order to prevent the sidesurface of the conductive line CW1 from being exposed from theinsulating film IF1, as with the first modification example of the firstembodiment.

When the terminal portion PD1 is formed, the visibility of the image tobe displayed in the display area is degraded, as the terminal portionPD1 is visible or the transmittance in the display area decreases.

Meanwhile, the insulating film IF1 is formed by performing the processthat has been described with reference to FIG. 36, and then, theelectrode portions EP1 and EP2 (see FIG. 32) and the connection portionCN2, which are composed of the light-shielding film containing metal oralloy as the main component, are formed by performing the process thathas been described with reference to FIG. 37 in the second embodiment.Thus, it is possible to prevent the generation of corrosion of thelight-shielding film, caused by the developing solution, in the processof forming the insulating film IF1. In addition, it is unnecessary toform the terminal portion PD1 (see FIG. 18) regardless of the materialof the light-shielding film SF1, and thus, it is possible to prevent orsuppress the terminal portion PD1 from being visible, and to prevent orsuppress the decrease of transmittance in the display area Ad (see FIG.5), thereby making it possible to improve the visibility of the image tobe displayed in the display area.

First Modification Example of Drive Electrode and Detection Electrodefor Touch Detection

Next, a description will be given regarding the first modificationexample of the drive electrode and the detection electrode for touchdetection.

FIG. 39 is a plan view illustrating a drive electrode and a detectionelectrode for touch detection in the first modification example of thesecond embodiment. FIG. 40 is a cross-sectional view illustrating thedrive electrode and the detection electrode for touch detection in thefirst modification example of the second embodiment. FIG. 40 is thecross-sectional view taken along a line C-C of FIG. 39.

In the first modification example, the electrode portion EP3 is formedbetween the electrode portion EP1 and the upper surface 31 b of thesubstrate 31, as illustrated in FIG. 40. The electrode portion EP3 iselectrically connected to the connection portion CN1, and further, iselectrically connected to the electrode portion EP1. The electrodeportion EP3 is composed of a transparent conductive film TC2. Theelectrode portion EP3 may be formed to be integrated with the connectionportion CN1.

Accordingly, it is possible to improve the conductivity of the driveelectrode DRV, to increase the capacitance between the drive electrodeDRV and the detection electrode TDL in the mutual capacitance system,and to increase the capacitance of the drive electrode DRV or thedetection electrode TDL in the self-capacitance system. Thus, it ispossible to improve the detection sensitivity of touch detection in thetouch detection device.

Incidentally, an electrode portion EP4 may be formed also between theelectrode portion EP2 and the upper surface 31 b of the substrate 31, asillustrated in FIG. 39. The electrode portion EP4 may be composed of thetransparent conductive film, as with the connection portion CN1.Accordingly, it is possible to adjust the distribution of the electricfield around the electrode portion EP2, to increase the capacitancebetween the drive electrode DRV and the detection electrode TDL in themutual capacitance system, and to increase the capacitance of the driveelectrode DRV or the detection electrode TDL in the self-capacitancesystem. Thus, it is possible to improve the detection sensitivity oftouch detection in the touch detection device.

Second Modification Example of Drive Electrode and Detection Electrodefor Touch Detection

Next, a description will be given regarding the second modificationexample of the drive electrode and the detection electrode for touchdetection.

FIG. 41 is a plan view illustrating a drive electrode and a detectionelectrode for touch detection in the second modification example of thesecond embodiment. FIG. 42 is a cross-sectional view illustrating thedrive electrode and the detection electrode for touch detection in thesecond modification example of the second embodiment. FIG. 42 is thecross-sectional view taken along a line C-C of FIG. 41.

In the second modification example, the electrode portion EP3 is formednot to be integrated with the connection portion CN1, but is formed tobe spaced apart from the connection portion CN1, as illustrated in FIGS.41 and 42. The other points can be configured, as with the firstmodification example of the second embodiment that has been describedwith reference to FIGS. 39 and 40.

However, the electrode portion EP3 is electrically connected to theelectrode portion EP1, and the electrode portion EP1 is electricallyconnected to the connection portion CN1. Thus, the second modificationexample is the same as the first modification example of the secondembodiment in that the electrode portion EP3 is electrically connectedto the connection portion CN1 and is electrically connected to theelectrode portion EP1.

The second modification example also has the same effect as the firstmodification example of the second embodiment, thereby making itpossible to improve the detection sensitivity of touch detection in thetouch detection device.

Third Modification Example of Drive Electrode and Detection Electrodefor Touch Detection

Next, a description will be given regarding the third modificationexample of the drive electrode and the detection electrode for touchdetection.

FIG. 43 is a plan view illustrating a drive electrode and a detectionelectrode for touch detection in the third modification example of thesecond embodiment. FIG. 44 is a cross-sectional view illustrating thedrive electrode and the detection electrode for touch detection in thethird modification example of the second embodiment. FIG. 44 is thecross-sectional view taken along a line C-C of FIG. 43.

In the third modification example, the insulating film IF3 is formedbetween any one of the plurality of electrode portions EP1 included ineach of the plurality of drive electrodes DRV, and the upper surface 31b of the substrate 31, as illustrated in FIG. 44. The insulating filmIF3 is composed of the same material as that of the insulating film IF1.It is possible to form the insulating film IF3 using thephotolithography, as with the insulating film IF1, or through theink-jet method or the electric field jet method.

In addition, the electrode portion EP3 is formed between the insulatingfilm IF3 and the upper surface 31 b of the substrate 31, as illustratedin FIG. 44, in the third modification example. The electrode portion EP3is not electrically connected to the connection portion CN1, andfurther, is not electrically connected to the electrode portion EP1,either. The electrode portion EP3 is composed of a transparentconductive film TC2.

In addition, the two electrode portions EP3, which are adjacent to eachother in the Y-axis direction, may be electrically connected with eachother via a connection portion CN4 in the third modification example.The two electrode portions EP3 and the connection portion CN4 may beformed in an integrated manner, and may be composed of the transparentconductive film as with the connection portion CN1. Accordingly, it ispossible to form an electrode SHL. The electrode SHL is formed of aplurality of the electrode portions EP3 which are arranged with aninterval in the Y-axis direction, and of a plurality of the connectionportions CN4 each of which electrically connects the two electrodeportions EP3 adjacent to each other in the Y-axis direction. Thus, whenthe electrode SHL is used as a shield electrode for active shield, it ispossible to reduce the influence of noise from the liquid crystaldisplay device at the time of touch detection, thereby making itpossible to improve the detection sensitivity of touch detection in thetouch detection device, as will be described with reference to FIGS. 45and 46 to be described later, for example.

Incidentally, a fixed potential may be supplied to the electrode SHL byallowing the electrode SHL to be connected to an external circuit thatsupplies the fixed potential. Alternatively, a potential of theelectrode SHL may be equal to a ground potential by allowing theelectrode SHL to be grounded. Alternatively, the electrode SHL may be inan electrically floating state, that is, in a floating state withoutbeing connected to the external circuit.

Alternatively, each of the plurality of electrode portions EP3 may be inan electrically floating state, that is, in a floating state, and thetwo electrode portions EP3, which are adjacent to each other in theY-axis direction, may not be electrically connected with each other viathe connection portion CN4.

In all the above-described cases, it is possible to adjust thedistribution of the electric field around the electrode portion EP1, toincrease the capacitance between the drive electrode DRV and thedetection electrode TDL in the mutual capacitance system, and toincrease the capacitance of the drive electrode DRV or the detectionelectrode TDL in the self-capacitance system. Thus, it is possible toimprove the detection sensitivity of touch detection in the touchdetection device.

FIGS. 45 and 46 are diagrams for describing the active shield in thethird modification example of the second embodiment.

Incidentally, a description will be given regarding the active shield atthe time of touch detection in the self-capacitance system hereinafter,but the active shield at the time of touch detection in the mutualcapacitance system can also be performed in the same manner.

As illustrated in FIG. 45, a shield circuit SHC to perform the activeshield includes a shield waveform application circuit CC1, the electrodeSHL, and a switch SW1 that connects the electrode SHL and the shieldwaveform application circuit CC1.

In the self-capacitance system, first, an operation to output a videosignal SIG for each of colors, in response to a signal SEL to selectthree colors of RGB, is executed for the entire display row, in a periodP1 illustrated in FIG. 46, thereby displaying a video of one frame.

Next, a touch detection operation of the self-capacitance system isexecuted by inputting a drive waveform to the plurality of detectionelectrodes TDS (see FIGS. 9 and 10), which is formed of the plurality ofdrive electrodes DRV and the plurality of detection electrodes TDL, in aperiod P2 illustrated in FIG. 46. At this time, the switch SW1 is set toa closed state, that is, a conduction state, so as to electricallyconnect the electrode SHL and the shield waveform application circuit CCwith each other, as illustrated in FIG. 45, at the time of executing thetouch detection operation in the period P2. Further, the same waveform,which is synchronized with the drive waveform to drive each of theplurality of detection electrodes TDS formed of the plurality of driveelectrodes DRV and the plurality of detection electrodes TDL, is inputto the electrode SHL, as illustrated in FIG. 46.

In other words, a signal having the same potential or the same phase asthe signal to be input to the detection electrode TDS (see FIG. 9 andFIG. 10) is input to the electrode SHL in the period P2 in which thetouch detection operation is executed. That is, when a signal (a TDSdrive waveform in FIG. 46) is input to the detection electrode TDSprovided on the upper surface 31 b of the substrate 31 in the displayprovided with the input device of the self-capacitance system, a signal(an SHL input waveform in FIG. 46) having the same potential or the samephase is input to the electrode SHL.

In other words, when the signal for touch detection is input to any oneof the plurality of electrode portions EP1, the signal for the activeshield having the same potential or the same phase as the signal fortouch detection is input to the electrode portion EP3 formed below anyone of the electrode portions EP1 via the insulating film IF3.

Accordingly, it is possible to reduce a parasitic capacitance betweenthe detection electrode TDS and a part around the detection electrodeTDS. Thus, it is possible to improve the responsiveness of the signal(the TDS drive waveform in FIG. 46), which is input to the detectionelectrode TDS, thereby making it possible to improve the touch detectionspeed. Alternatively, it is possible to improve the touch detectionsensitivity as a noise signal, that is, noise is reduced in a signal (aTDS detection waveform in FIG. 46) which is detected in the detectionelectrode TDS.

Incidentally, an electrode to apply a shield waveform is not limited tothe electrode SHL, in the case of performing the active shield at thetime of touch detection in the self-capacitance system. Accordingly, forexample, the shield waveform may be applied to any one of the driveelectrode COML, the signal line SGL, the scan line GCL, the dummyelectrode (not illustrated), the routing wiring (not illustrated) formedin the surrounding area As, and the other various types of portionshaving conductivity. In this case, it is also possible to reduce theparasitic capacitance between the detection electrode TDS and the partaround the detection electrode TDS, thereby making it possible toimprove the touch detection speed, and to improve the touch detectionsensitivity.

Incidentally, although the description has been given in theabove-described example regarding a case where the active shield isapplied to the display provided with the input device of theself-capacitance system, the above-described active shield can beapplied also to a display provided with an input device of the mutualcapacitance system.

Third Embodiment

The description has been given in the first embodiment regarding theexample in which the touch panel serving as the input device is providedonto the counter substrate 3 of the liquid crystal display, and further,is applied to the touch detection function-equipped liquid crystaldisplay of the on-cell type in which the drive electrode COML of thedisplay has no function as the drive electrode of the input device. Onthe other hand, a description will be given in a third embodimentregarding an example in which a touch panel serving as an input deviceis applied to an input device which can be used as a touch detectionfunction-equipped liquid crystal display by externally mounting thetouch panel to a display plane side of the liquid crystal display.

Incidentally, the input device according to the third embodiment can beexternally mounted to each display plane side of various types ofdisplays such as the liquid crystal display, and the organic EL display.

<Input Device>

FIG. 47 is a cross-sectional view illustrating the input deviceaccording to the third embodiment. In the example illustrated in FIG.47, the input device has substantially the same configuration as that ofthe substrate 31, the protective film 33, and a part between thesubstrate 31 and the protective film 33 in the touch detectionfunction-equipped display device illustrated in FIG. 6.

As illustrated in FIG. 47, the input device according to the thirdembodiment includes the plurality of drive electrodes DRV and theplurality of detection electrodes TDL, which are provided on the uppersurface 31 b of the substrate 31, and the protective film 33. Inaddition, as with the first embodiment, each of the plurality of driveelectrodes DRV includes the plurality of electrode portions EP1 and theplurality of connection portions CN1 (see FIG. 11), and each of theplurality of detection electrodes TDL includes the plurality ofelectrode portions EP2 and the plurality of connection portions CN2 (seeFIG. 11), also in the third embodiment.

As with the input device provided in the display according to the firstembodiment, the input device according to the third embodiment also haseach of the plurality of electrode portions EP1 and the plurality ofelectrode portions EP2 containing metal or alloy as the main componentand having the mesh shape, and thus, the input device according to thethird embodiment has the same effect as that of the display according tothe first embodiment.

In addition, an input device, which is provided in each display in themodification examples of the first embodiment, in the second embodiment,and in the modification examples of the second embodiment, can beapplied, as the modification example of the input device according tothe third embodiment.

As described above, the invention by the inventors has been specificallyexplained according to the embodiments, however, it is obvious that theinvention is not limited to the embodiments and various changes may bemade without departing from the scope of the invention.

Further, in the foregoing embodiments, the cases of a liquid crystaldisplay have been illustrated as disclosure examples, but all kinds offlat-panel displays such as an organic EL display, other self-luminoustype displays and electronic paper displays having electrophoresiselements may be listed as other application examples. Further, it goeswithout saying that the present invention is applicable to small, mediumand large sized devices without any particular limitation.

In the category of the idea of the present invention, a person withordinary skill in the art can conceive various modification examples andrevised examples, and such modification examples and revised examplesare also deemed to belong to the scope of the present invention.

For example, the examples obtained by appropriately making theadditions, deletions or design changes of components or the additions,deletions or condition changes of processes to respective embodimentsdescribed above by a person with ordinary skill in the art also belongto the scope of the present invention as long as they include the gistof the present invention.

The present invention is effective when applied to a display, an inputdevice, and a manufacturing method of the display.

It should be understood that various changes and modifications to thepresently preferred embodiments described herein will be apparent tothose skilled in the art. Such changes and modifications can be madewithout departing from the spirit and scope of the present subjectmatter and without diminishing its intended advantages. It is thereforeintended that such changes and modifications be covered by the appendedclaims.

What is claimed is:
 1. An input device comprising: a substrate; aplurality of first metal or alloy electrodes provided along a firstdirection on a main surface of the substrate; a plurality of secondmetal or alloy electrodes provided along a second direction intersectingwith the first direction on the same surface as the main surface; aplurality of second connection portions; an insulating film; and aprotective film covering the plurality of first metal or alloyelectrodes, the plurality of second metal or alloy electrodes, theplurality of second connection portions, and the insulating film,wherein each of the plurality of first metal or alloy electrodesincludes: a plurality of first mesh shape electrode portions; and aplurality of first connection portions each of which connects adjacenttwo of the first mesh shape electrode portions, wherein each of theplurality of second metal or alloy electrodes includes a plurality ofsecond mesh shape electrode portions, wherein each of the first meshshape electrode portions, the first connection portions, and the secondmesh shape electrode portions contains metal, and is formed on the samesurface as the main surface, wherein each of the plurality of secondconnection portions connects adjacent two of the second mesh shapeelectrode portions, and is composed of a transparent conductive film,wherein each of the first connection portions is overlapped with each ofthe second connection portions with the insulating film, wherein theinsulating film is formed between each of the first connection portionsand each of the second connection portions, and wherein one of the firstconnection portions and the second connection portions is composed of alight-shielding metal or alloy, and wherein the protective film isthicker than the insulating film.
 2. The input device according to claim1, wherein each of the first electrode portions and the second electrodeportions has a light shielding property.
 3. The input device accordingto claim 1, further comprising: a second insulating film which coversany one of the plurality of first electrode portions; and a thirdelectrode portion that is formed on any one of the first electrodeportions via the second insulating film, wherein the third electrodeportion is composed of a second transparent conductive film.
 4. Theinput device according to claim 3, wherein the third electrode portionis in an electrically floating state.
 5. The input device according toclaim 3, wherein an input position is detected using a detection valueof the first metal or alloy electrode based on a first signal which is adrive signal for touch detection, and wherein a second signal having asame potential or a same phase as the first signal is input to the thirdelectrode portion when the first signal is input to any one of the firstelectrode portion and the second electrode portion.
 6. The input deviceaccording to claim 1, wherein each of the plurality of first metal oralloy electrodes includes a plurality of first terminal portions each ofwhich is electrically connected to each of the plurality of firstelectrode portions, wherein each of the plurality of first electrodeportions has a mesh shape which is formed of a plurality of firstconductive lines and a plurality of second conductive lines intersectingwith each other, wherein each of the plurality of first connectionportions electrically connects the two first terminal portions which areelectrically connected respectively to the two first electrode portions,and wherein a first width of the first terminal portion in the firstdirection is wider than a second width of the first conductive line inthe first direction and a third width of the second conductive line inthe first direction.